The prediction of dishing and erosion caused by CMP is desired as they adversely affect the electrical properties of interconnects in integrated circuits. For a model to properly capture these phenomena, it must account for the time dependent surface evolution in CMP. This work employs the previously introduced Particle-Augmented Mixed Lubrication (PAML) model to predict dishing and erosion in CMP. By using PAML to model the polishing of a patterned wafer, it is possible to predict the dishing and erosion experienced during CMP.
- Tribology Division
A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers
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Mpagazehe, JN, Thukalil, GA, & Higgs, CF, III. "A Multi-Physics Computational Framework to Predict Dishing and Erosion in Patterned Wafers." Proceedings of the ASME/STLE 2009 International Joint Tribology Conference. ASME/STLE 2009 International Joint Tribology Conference. Memphis, Tennessee, USA. October 19–21, 2009. pp. 27-29. ASME. https://doi.org/10.1115/IJTC2009-15205
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