A numerical simulation is presented for several loading-unloading cycles of an adhesive contact between an elastic-plastic sphere and a rigid flat. The main goal of the simulation is to study the plastic deformation evolution in a contact bump material — the microscopic electrode found in a MEMS micro-switch for providing a good electric contact. This bump is subjected to a cyclic contact interaction with a harder substrate and cyclic plasticity of the bump material can lead to its wear and as result to a failure of the whole MEMS device.
- Tribology Division
Cyclic Loading of an Elastic-Plastic Adhesive Contact
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Kadin, Y, Kligerman, Y, & Etsion, I. "Cyclic Loading of an Elastic-Plastic Adhesive Contact." Proceedings of the STLE/ASME 2008 International Joint Tribology Conference. STLE/ASME 2008 International Joint Tribology Conference. Miami, Florida, USA. October 20–22, 2008. pp. 27-29. ASME. https://doi.org/10.1115/IJTC2008-71055
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