A numerical simulation is presented for several loading-unloading cycles of an adhesive contact between an elastic-plastic sphere and a rigid flat. The main goal of the simulation is to study the plastic deformation evolution in a contact bump material — the microscopic electrode found in a MEMS micro-switch for providing a good electric contact. This bump is subjected to a cyclic contact interaction with a harder substrate and cyclic plasticity of the bump material can lead to its wear and as result to a failure of the whole MEMS device.

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