Leaf-related low adhesion problems have been present in many railway networks all over the world in the last decades. One of the counter measures adopted by many railway networks is the use of friction modifiers. However, the effectiveness of these friction modifiers is not well proven yet due to the lack of research in controlled conditions. In this paper, a laboratory study of a widely used friction modifier is presented together with another adhesion enhancer designed for wet wheel-rail contacts due to rainfall. A twin-disk roller rig has been used to investigate their performance in leaf contaminated contacts. The adhesion characteristics of both friction modifiers were examined for different slip ratios. The constituents of the friction modifiers are identified and their suitability for leafy contacts is evaluated.
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STLE/ASME 2008 International Joint Tribology Conference
October 20–22, 2008
Miami, Florida, USA
Conference Sponsors:
- Tribology Division
ISBN:
978-0-7918-4336-9
PROCEEDINGS PAPER
Rolling-Sliding Laboratory Tests of Friction Modifiers in Leaf Contaminated Wheel-Rail Contacts
Oscar Arias-Cuevas,
Oscar Arias-Cuevas
Delft University of Technology, Delft, The Netherlands
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Zili Li,
Zili Li
Delft University of Technology, Delft, The Netherlands
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Roger Lewis,
Roger Lewis
University of Sheffield, Sheffield, UK
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Alberto Gallardo-Hernandez
Alberto Gallardo-Hernandez
University of Sheffield, Sheffield, UK
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Oscar Arias-Cuevas
Delft University of Technology, Delft, The Netherlands
Zili Li
Delft University of Technology, Delft, The Netherlands
Roger Lewis
University of Sheffield, Sheffield, UK
Alberto Gallardo-Hernandez
University of Sheffield, Sheffield, UK
Paper No:
IJTC2008-71090, pp. 213-215; 3 pages
Published Online:
June 5, 2009
Citation
Arias-Cuevas, O, Li, Z, Lewis, R, & Gallardo-Hernandez, A. "Rolling-Sliding Laboratory Tests of Friction Modifiers in Leaf Contaminated Wheel-Rail Contacts." Proceedings of the STLE/ASME 2008 International Joint Tribology Conference. STLE/ASME 2008 International Joint Tribology Conference. Miami, Florida, USA. October 20–22, 2008. pp. 213-215. ASME. https://doi.org/10.1115/IJTC2008-71090
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