This research investigates the tribological interactions in removal of nano-sized particles during post chemical-mechanical polishing (CMP) cleaning. Possible surface interactive forces are discussed in order to understand the particle adhesion and subsequent removal through physical and mechanical interactions. The investigation was carried out using theoretical analysis combined with experimental study. The theoretical analysis was based on the particle adhesion and removal. Surface interaction consideration includes brush load, frictional force, and hydrodynamic drag. Finite element modeling using ABAQUS was used. The polishing experiments were done on silicon wafers with SiO2 slurry. Cleaning tests were done using DI water to brush clean the adhered particles from hydrophilic silicon surface. An Atomic Force Microscope (AFM) was used to evaluate the effective cleaning topography. It was found that particles are removed through sliding and rolling. The fluid film behavior was successfully illustrated using a modified Stribeck behavior with considering of changing material properties. New particle removal mechanisms and lubrication model were proposed.
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STLE/ASME 2006 International Joint Tribology Conference
October 23–25, 2006
San Antonio, Texas, USA
Conference Sponsors:
- Tribology Division
ISBN:
0-7918-4259-2
PROCEEDINGS PAPER
Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning Available to Purchase
Dedy Ng,
Dedy Ng
Texas A&M University, College Station, TX
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Ting-Gang Zhang,
Ting-Gang Zhang
University of Alaska-Fairbanks, Fairbanks, AK
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Hong Liang
Hong Liang
Texas A&M University, College Station, TX
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Dedy Ng
Texas A&M University, College Station, TX
Ting-Gang Zhang
University of Alaska-Fairbanks, Fairbanks, AK
Hong Liang
Texas A&M University, College Station, TX
Paper No:
IJTC2006-12141, pp. 929-937; 9 pages
Published Online:
October 2, 2008
Citation
Ng, D, Zhang, T, & Liang, H. "Interfacial Force Analysis and Lubrication Behavior During Post-CMP Cleaning." Proceedings of the STLE/ASME 2006 International Joint Tribology Conference. Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology. San Antonio, Texas, USA. October 23–25, 2006. pp. 929-937. ASME. https://doi.org/10.1115/IJTC2006-12141
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