Contact Stress Analysis of Thin Film Compression: Modeling, Simulation, and Experiment Available to Purchase

Two different elastic contact stress modeling approaches were compared to results from a flat punch compression experiment. The two approaches, which employed the Greenwood and Williamson contact stress model and the Volume Pixel (“Voxel”) asperity modeling simulation, were used to analyze the force-displacement response of a sample surface when pressed down by a smooth, rigid, flat plane to a prescribed load. The results of the model and simulation are compared to experimental measurements from the flat punch compression performed using a nanoindenter.