Two different elastic contact stress modeling approaches were compared to results from a flat punch compression experiment. The two approaches, which employed the Greenwood and Williamson contact stress model and the Volume Pixel (“Voxel”) asperity modeling simulation, were used to analyze the force-displacement response of a sample surface when pressed down by a smooth, rigid, flat plane to a prescribed load. The results of the model and simulation are compared to experimental measurements from the flat punch compression performed using a nanoindenter.
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Contact Stress Analysis of Thin Film Compression: Modeling, Simulation, and Experiment
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Terrell, E, & Higgs, CF, III. "Contact Stress Analysis of Thin Film Compression: Modeling, Simulation, and Experiment." Proceedings of the STLE/ASME 2006 International Joint Tribology Conference. Part B: Magnetic Storage Tribology; Manufacturing/Metalworking Tribology; Nanotribology; Engineered Surfaces; Biotribology; Emerging Technologies; Special Symposia on Contact Mechanics; Special Symposium on Nanotribology. San Antonio, Texas, USA. October 23–25, 2006. pp. 1487-1492. ASME. https://doi.org/10.1115/IJTC2006-12300
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