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Proceedings Papers

Thermoelectric Self-Cooling on Germanium Chip

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Peng Wang, Avram Bar-Cohen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 891-898, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23312
https://doi.org/10.1115/IHTC14-23312
... 09 03 2011 Growing interest in germanium solid-state devices is raising concern over the effects of on-chip, micro-scaled, high flux hot spot on the reliability and performance of germanium chips. Current thermal management technology offers few choices for such on-chip hot spot...
View Paper titled, Thermoelectric Self-Cooling on Germanium Chip
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Topics: Cooling, Germanium, Thermal management
Proceedings Papers

Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks

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Yong-Jiun Lee, Poh-Seng Lee, Siaw-Kiang Chou
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 283-291, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23413
https://doi.org/10.1115/IHTC14-23413
...% respectively. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques. enhanced microchannel oblique fins thermal management electronic cooling 1 Copyright © 2010 by ASME...
View Paper titled, Experimental Investigation of Silicon-Based Oblique Finned Microchannel Heat Sinks
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Topics: Fins, Heat sinks, Microchannels, Silicon