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Keywords: Electronic Cooling
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Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 671-674, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23015
... Thin-film Gas-Assisted Evaporation Phase change Electronic Cooling High heat fluxes Hotspot thermal management Presence of hotspots in microprocessors requires localized dissipation of high heat fluxes. While typical background cooling solutions (e.g. air cooling with heat sinks...
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 5, 629-638, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22720
... been proposed. For the data in the range of Re = 1655 ∼ 8960, Bo = 0.024 ∼ 0.389, surface area enhancement ratio (γ A ) = 2.07 ∼ 5.32, this correlation predicts 94% of the present data within ±20%. jet impingement electronic cooling straight fin 1 Copyright © 2010 by ASME Proceedings...
Proceedings Papers

Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 283-291, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23413
...% respectively. Interestingly, there is only little or negligible pressure drop penalty associated with this novel heat transfer enhancement scheme in contrast to conventional enhancement techniques. enhanced microchannel oblique fins thermal management electronic cooling 1 Copyright © 2010 by ASME...