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Proceedings Papers

Thermal Management Issues in Fuel Cell Technology

N. P. Brandon, M. Matian, A. J. Marquis, C. S. Adjiman
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 591-599, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23396
https://doi.org/10.1115/IHTC14-23396
View Paper titled, Thermal Management Issues in Fuel Cell Technology
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Topics: Fuel cell technology, Thermal management, Fuel cells, Proton exchange membrane fuel cells, Solid oxide fuel cells, Temperature, Heat transfer, Chemical energy, Combustion, Design
Proceedings Papers

Interfacial Thermal Fluid Phenomena in Thin Liquid Films

Oleg A. Kabov
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 8, 229-249, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22959
https://doi.org/10.1115/IHTC14-22959
View Paper titled, Interfacial Thermal Fluid Phenomena in Thin Liquid Films
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Topics: Lubrication theory, Thermofluids, Flow (Dynamics), Liquid films, Heat flux, Heating, Shear (Mechanics), Water, Atmospheric pressure, Critical heat flux
Proceedings Papers

Pool Boiling of Mixtures for Electronics Thermal Management

Aravind Sathyanarayana, Yogendra Joshi, Yunhyeok Im
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 583-589, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22950
https://doi.org/10.1115/IHTC14-22950
View Paper titled, Pool Boiling of Mixtures for Electronics Thermal Management
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Topics: Electronics, Heat transfer, Pool boiling, Thermal management
Proceedings Papers

Thermal Management Considerations for Geographically Distributed Computing Infrastructures

Amip Shah, Cullen Bash, Martin Arlitt, Yuan Chen, Daniel Gmach, Ratnesh Sharma, Chandrakant Patel
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 619-628, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22912
https://doi.org/10.1115/IHTC14-22912
View Paper titled, Thermal Management Considerations for Geographically Distributed Computing Infrastructures
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Topics: Thermal management, Cooling, Data centers, Modeling, Resource allocation
Proceedings Papers

High-Flux Thin Film Evaporation on Nanostructured Surfaces

Rong Xiao, Kuang-Han Chu, Evelyn N. Wang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 853-860, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22905
https://doi.org/10.1115/IHTC14-22905
View Paper titled, High-Flux Thin Film Evaporation on Nanostructured Surfaces
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Topics: Evaporation, Thin films, Heat, Liquid films, Energy dissipation, Columns (Structural), Design, Electronic systems, Electronics, Flow (Dynamics)
Proceedings Papers

An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems

Siddharth Bhopte, Seshu B. Desu, Bahgat Sammakia
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 629-635, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22918
https://doi.org/10.1115/IHTC14-22918
View Paper titled, An Integrated Nano-Structured Heat Spreader for High Heat Flux Electronic Systems
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Topics: Electronic systems, Flat heat pipes, Heat flux, Heat, Thermal conductivity, Design, Electronic packages, Thermal management, Carbon, Dimensions
Proceedings Papers

Active Flow Instability Control for Transient Two-Phase Electronics Cooling

Tie Jun Zhang, Yoav Peles, John T. Wen, Michael K. Jensen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 637-648, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22919
https://doi.org/10.1115/IHTC14-22919
View Paper titled, Active Flow Instability Control for Transient Two-Phase Electronics Cooling
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Topics: Computer cooling, Flow instability, Transients (Dynamics), Boiling, Flow (Dynamics), Critical heat flux, Cooling, Heat, Oscillations, Refrigeration
Proceedings Papers

Temperature Field Prediction of a Multilayered Composite Pipeline Based on the Particle Filter Method

Flavio L. V. Vianna, Helcio R. B. Orlande, George S. Dulikravich
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 523-532, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22462
https://doi.org/10.1115/IHTC14-22462
View Paper titled, Temperature Field Prediction of a Multilayered Composite Pipeline Based on the Particle Filter Method
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Topics: Composite materials, Filters, Particulate matter, Pipelines, Temperature, Fluids, Manufacturing systems, Petroleum, Density, Finite volume methods
Proceedings Papers

The Application of Entransy Dissipation Theory in the Volume-to-Point Heat Conduction Problem

Liang Ge, Mingtian Xu, Lin Cheng
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 299-304, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22271
https://doi.org/10.1115/IHTC14-22271
View Paper titled, The Application of Entransy Dissipation Theory in the Volume-to-Point Heat Conduction Problem
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Topics: Energy dissipation, Heat conduction, Heat, Electrical conductivity, Thermal conductivity, Computer cooling, Cooling, Finite element methods, Integrated circuits, Operating temperature
Proceedings Papers

Thermoelectric Self-Cooling on Germanium Chip

Peng Wang, Avram Bar-Cohen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 891-898, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23312
https://doi.org/10.1115/IHTC14-23312
View Paper titled, Thermoelectric Self-Cooling on Germanium Chip
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Topics: Cooling, Germanium, Thermal management
Proceedings Papers

Performance of Glass Heat Pipes for Solar Thermoelectric Energy Systems

Nenad Miljkovic, Evelyn N. Wang
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 547-556, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22816
https://doi.org/10.1115/IHTC14-22816
View Paper titled, Performance of Glass Heat Pipes for Solar Thermoelectric Energy Systems
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Topics: Energy / power systems, Glass, Heat pipes, Solar energy, Manufacturing, Cooling, Design, Energy conversion, Geometry, Heat
Proceedings Papers

Effect of Periodic Pulsations on Heat Transfer in Simultaneously Developing Laminar Flows: A Numerical Study

Balkrishna Mehta, Sameer Khandekar
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 569-576, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22519
https://doi.org/10.1115/IHTC14-22519
View Paper titled, Effect of Periodic Pulsations on Heat Transfer in Simultaneously Developing Laminar Flows: A Numerical Study
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Topics: Heat transfer, Laminar flow, Flow (Dynamics), Internal flow, Unsteady flow, Ducts, Electronics, Engineering systems and industry applications, Friction, Microelectromechanical systems
Proceedings Papers

Parametric Dependence of Annular Flow Heat Transfer in Microgaps

Emil Rahim, Avram Bar-Cohen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 263-272, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23315
https://doi.org/10.1115/IHTC14-23315
View Paper titled, Parametric Dependence of Annular Flow Heat Transfer in Microgaps
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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Dielectric liquids, Fluids, Microchannels, Refrigerants, Semiconductor devices, Thermal management
Proceedings Papers

Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications

Suchismita Ghosh, Denis L. Nika, Evgenni P. Pokatilov, Irene Calizo, Alexander A. Balandin
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 345-352, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22348
https://doi.org/10.1115/IHTC14-22348
View Paper titled, Extraordinary Thermal Conductivity of Graphene: Prospects of Thermal Management Applications
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Topics: Graphene, Thermal conductivity, Thermal management, Temperature, Lasers, Phonons, Carbon, Dimensions, Electromagnetic scattering, Graphite
Proceedings Papers

Investigation of Interfacial Thermal Resistance on Nano-Structures Using Molecular Dynamics Simulations

Navdeep Singh, Debjyoti Banerjee
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 427-431, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22930
https://doi.org/10.1115/IHTC14-22930
View Paper titled, Investigation of Interfacial Thermal Resistance on Nano-Structures Using Molecular Dynamics Simulations
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Topics: Interfacial thermal resistance, Molecular dynamics simulation, Nanostructures , Carbon nanotubes, Nanotubes, Temperature, Thermal conductivity, Composite materials, Heat transfer, Simulation
Proceedings Papers

Fluorescence Thermometry for Measuring Wall Surface and Bulk Fluid Temperatures

Myeongsub Kim, Minami Yoda
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 65-74, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22884
https://doi.org/10.1115/IHTC14-22884
View Paper titled, Fluorescence Thermometry for Measuring Wall Surface and Bulk Fluid Temperatures
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Topics: Fluids, Fluorescence, Temperature, Temperature measurement, Resolution (Optics), Water, Emissions, Flow (Dynamics), Signals, Uncertainty
Proceedings Papers

Using Quantum Dots for Liquid-Phase Thermometry at Near-Infrared Wavelengths in Silicon Devices

Myeongsub Kim, Minami Yoda
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 75-81, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22885
https://doi.org/10.1115/IHTC14-22885
View Paper titled, Using Quantum Dots for Liquid-Phase Thermometry at Near-Infrared Wavelengths in Silicon Devices
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Topics: Quantum dots, Silicon, Temperature measurement, Wavelength, Temperature, Emissions, Coolants, Shells, Resolution (Optics), Density
Proceedings Papers

Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management

Shankar Narayanan, Andrei G. Fedorov, Yogendra K. Joshi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 671-674, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23015
https://doi.org/10.1115/IHTC14-23015
View Paper titled, Gas Assisted Thin-Film Evaporation for Hotspot Thermal Management
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Topics: Evaporation, Flux (Metallurgy), Heat, Thermal management, Thin films
Proceedings Papers

Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots

Vivek Sahu, Yogendra K. Joshi, Andrei G. Fedorov
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 681-687, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23054
https://doi.org/10.1115/IHTC14-23054
View Paper titled, Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots
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Topics: Coolers, Heat sinks, Microchannels, Superlattices, Thermal management
Proceedings Papers

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Mark Eblen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 603-610, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22891
https://doi.org/10.1115/IHTC14-22891
View Paper titled, Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages
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Topics: Ceramics, Copper, Thermal conductivity, Design, Finite element analysis, Flip-chip, Flip-chip devices, Heat, Heat conduction, Integrated circuits