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Proceedings Papers

Simulation of Electron Beam Heating of a Cu Thin Film on a Si Substrate

Vance S. Robinson, Xi Zhang, Forrest Hopkins
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 545-549, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23333
https://doi.org/10.1115/IHTC14-23333
View Paper titled, Simulation of Electron Beam Heating of a Cu Thin Film on a Si Substrate
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Topics: Cathode ray oscilloscopes, Electron beams, Heating, Simulation, Thin films, Bulk solids, Copper, Critical phenomena (Physics), Electron scattering, Electrons
Proceedings Papers

Modeling of Thermal Contact Conductance

Mikhail V. Murashov, Sergey D. Panin
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 387-392, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22616
https://doi.org/10.1115/IHTC14-22616
View Paper titled, Modeling of Thermal Contact Conductance
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Topics: Contact resistance, Modeling, Deformation, Surface roughness, Heat transfer, Copper, Heat conduction, Pressure, Compression, Cycles
Proceedings Papers

The Role of Liquid Layering on the Enhancement of Thermal Conductivity in Nanofluids

M. Reza Azizian, Elham Doroodchi, Behdad Moghtaderi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 659-665, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23418
https://doi.org/10.1115/IHTC14-23418
View Paper titled, The Role of Liquid Layering on the Enhancement of Thermal Conductivity in Nanofluids
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Topics: Nanofluids, Thermal conductivity, Copper, Water
Proceedings Papers

Pool Boiling Characteristics of Heat Transfer Surface With Micro Structures Created by Using MEMS Technology

Yasuo Koizumi, Hiroyasu Ohtake, Takato Sato
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 153-160, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22087
https://doi.org/10.1115/IHTC14-22087
View Paper titled, Pool Boiling Characteristics of Heat Transfer Surface With Micro Structures Created by Using MEMS Technology
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Topics: Heat transfer, Microelectromechanical systems, Pool boiling, Cavities, Boiling, Columns (Structural), Cooling, Nucleate boiling, Subcooling, Copper
Proceedings Papers

Subcooled Flow Boiling With Sintered Porous Coatings in Small Channel

Yan Sun, Li Zhang, Hong Xu, Dongmei Ji
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 317-326, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22565
https://doi.org/10.1115/IHTC14-22565
View Paper titled, Subcooled Flow Boiling With Sintered Porous Coatings in Small Channel
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Topics: Boiling, Coatings, Flow (Dynamics), Subcooling, Heat transfer, Air conditioning, Atmospheric pressure, Cooling, Copper, Fluids
Proceedings Papers

Saturation and Subcooled Boiling on Copper Nano-Dendrites Surfaces

Mohamed S. El-Genk, Amir F. Ali
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 161-170, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22108
https://doi.org/10.1115/IHTC14-22108
View Paper titled, Saturation and Subcooled Boiling on Copper Nano-Dendrites Surfaces
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Topics: Boiling, Copper, Subcooling, Critical heat flux, Heart failure, Nucleate boiling
Proceedings Papers

Investigation of Flow Boiling on Nanostructured Surfaces

Saeil Jeon, Pratanu Roy, N. K. Anand, Debjyoti Banerjee
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 577-582, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22926
https://doi.org/10.1115/IHTC14-22926
View Paper titled, Investigation of Flow Boiling on Nanostructured Surfaces
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Topics: Boiling, Flow (Dynamics), Bubbles, Carbon nanotubes, Copper, Heat flux, Silicon, Semiconductor wafers, Temperature, Water
Proceedings Papers

Single Phase and Flow Boiling Heat Transfer of Water and Ethanol in a Mini-Channel Array

M. W. Alnaser, K. Spindler, H. Mu¨ller-Steinhagen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 365-374, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22608
https://doi.org/10.1115/IHTC14-22608
View Paper titled, Single Phase and Flow Boiling Heat Transfer of Water and Ethanol in a Mini-Channel Array
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Topics: Boiling, Ethanol, Flow (Dynamics), Heat transfer, Water, Heat flux, Heat transfer coefficients, Flux (Metallurgy), Heat, Subcooling
Proceedings Papers

Wall Thermal Conductivity Effects on Nucleation Site Interaction During Boiling: An Experimental Study

Yu Yan Jiang, Hiroshi Osada, Masahide Inagaki, Nariaki Horinouchi
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 637-646, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23140
https://doi.org/10.1115/IHTC14-23140
View Paper titled, Wall Thermal Conductivity Effects on Nucleation Site Interaction During Boiling: An Experimental Study
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Topics: Boiling, Nucleation (Physics), Thermal conductivity, Heat transfer, Stainless steel, Cavities, Copper, Bubbles, Heat flux, Density
Proceedings Papers

Sub-Atmospheric Pressure, Subcooled, Flow Boiling of Water on Screen Laminate Enhanced Surfaces

S. J. Penley, R. A. Wirtz
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 479-488, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22741
https://doi.org/10.1115/IHTC14-22741
View Paper titled, Sub-Atmospheric Pressure, Subcooled, Flow Boiling of Water on Screen Laminate Enhanced Surfaces
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Topics: Boiling, Flow (Dynamics), Laminates, Pressure, Subcooling, Water, Critical heat flux, Reynolds number, Bubbles, Copper
Proceedings Papers

Heat Transfer Mechanisms of Propane Boiling on Horizontal Steel Tubes With Smooth and Enhanced Surfaces

A. Luke, Bjo¨rn C. F. Mu¨ller
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 553-561, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22887
https://doi.org/10.1115/IHTC14-22887
View Paper titled, Heat Transfer Mechanisms of Propane Boiling on Horizontal Steel Tubes With Smooth and Enhanced Surfaces
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Topics: Boiling, Heat transfer, Steel, Cavities, Bubbles, Heat transfer coefficients, Polishing, Heat, Copper, Flux (Metallurgy)
Proceedings Papers

Experimental Study and Numerical Analysis of Water Single-Phase Pressure Drop Across a Micro-Pin-Fin Array

Christopher A. Konishi, Ruey Hwu, Weilin Qu, Frank E. Pfefferkorn
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 711-719, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23171
https://doi.org/10.1115/IHTC14-23171
View Paper titled, Experimental Study and Numerical Analysis of Water Single-Phase Pressure Drop Across a Micro-Pin-Fin Array
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Topics: Numerical analysis, Pressure drop, Water, Flow (Dynamics), Temperature, Copper, Fins, Friction, Reynolds number
Proceedings Papers

Experimental Study on the Flow Regime Identification in the Case of Co-Current Condensation of R134a in a Vertical Smooth Tube

Ahmet Selim Dalkilic, Somchai Wongwises
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 1-10, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22057
https://doi.org/10.1115/IHTC14-22057
View Paper titled, Experimental Study on the Flow Regime Identification in the Case of Co-Current Condensation of R134a in a Vertical Smooth Tube
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Topics: Condensation, Flow (Dynamics), Cooling, Heat transfer coefficients, Temperature, Water, Copper, Fluids, Flux (Metallurgy), Glass
Proceedings Papers

Dropwise Condensation Life Testing of Self Assembled Monolayers

Richard W. Bonner, III
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 2, 221-226, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22936
https://doi.org/10.1115/IHTC14-22936
View Paper titled, Dropwise Condensation Life Testing of Self Assembled Monolayers
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Topics: Condensation, Life testing, Self-assembly, Coatings, Electronics, Heat pipes, Computer cooling, Copper, Electronic packages, Flux (Metallurgy)
Proceedings Papers

The Study of Calcium Carbonate Scaling on Low Energy Surfaces

Xiuhua Si, Jinxiang Xi, Xihai Tao
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 149-156, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22058
https://doi.org/10.1115/IHTC14-22058
View Paper titled, The Study of Calcium Carbonate Scaling on Low Energy Surfaces
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Topics: Contamination, Cooling, Copper, Dimensions, Electromagnetic induction, Fractals, Heat exchangers, Heat transfer, Incrustations, Metal surfaces
Proceedings Papers

Development of a Profiled Multilayer Tube for High Temperature Solar Receivers and Heat Exchangers

Jens Jedamski, Lars Amsbeck, Reiner Buck, Raphael Couturier, Peter Heller, Patrice Tochon, Ralf Uhlig, Felipe Vasquez
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 483-489, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22094
https://doi.org/10.1115/IHTC14-22094
View Paper titled, Development of a Profiled Multilayer Tube for High Temperature Solar Receivers and Heat Exchangers
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Topics: Heat exchangers, High temperature, Solar energy, Copper, Alloys, Heat transfer, Nickel, Solar radiation, Temperature, Temperature distribution
Proceedings Papers

Heat Transfer to Suspensions of Microencapsulated Phase Change Material (MEPCM) Flowing Through Minichannels

Frank Dammel, Peter Stephan
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 399-408, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22253
https://doi.org/10.1115/IHTC14-22253
View Paper titled, Heat Transfer to Suspensions of Microencapsulated Phase Change Material (MEPCM) Flowing Through Minichannels
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Topics: Heat transfer, Phase change materials, Particulate matter, Temperature, Cooling, Flow (Dynamics), Heat, Latent heat, Pressure drop, Water
Proceedings Papers

Thermal Behavior of Phase Change Material During Charging Inside a Finned Cylindrical Latent Heat Energy Storage System: Effects of the Arrangement and Number of Fins

Dominic Groulx, Wilson Ogoh
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 417-424, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22397
https://doi.org/10.1115/IHTC14-22397
View Paper titled, Thermal Behavior of Phase Change Material During Charging Inside a Finned Cylindrical Latent Heat Energy Storage System: Effects of the Arrangement and Number of Fins
Open the PDF for Thermal Behavior of Phase Change Material During Charging Inside a Finned Cylindrical Latent Heat Energy Storage System: Effects of the Arrangement and Number of Fins in another window
Topics: Energy storage, Fins, Latent heat, Phase change materials, Melting, Water, Containers, Convection, Copper, Finite element methods
Proceedings Papers

Optimization of a Phase Change Thermal Storage Unit

Monica F. Bonadies, Mark Ricklick, J. S. Kapat
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 7, 463-476, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22984
https://doi.org/10.1115/IHTC14-22984
View Paper titled, Optimization of a Phase Change Thermal Storage Unit
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Topics: Optimization, Thermal energy storage, Fins, Fluids, Heat exchangers, Storage, Water, Heat transfer, Paraffin wax, Temperature
Proceedings Papers

Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages

Mark Eblen
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 603-610, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22891
https://doi.org/10.1115/IHTC14-22891
View Paper titled, Effective Thermal Conductivity of Six Sigma’s Copper Reinforced Column Grid Array Interconnect for Ceramic Microelectronic Packages
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Topics: Ceramics, Copper, Thermal conductivity, Design, Finite element analysis, Flip-chip, Flip-chip devices, Heat, Heat conduction, Integrated circuits