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Proceedings Papers

Significant Heat Transfer Enhancement in Microchannels With a Segmented Flow of Two Immiscible Liquids

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Ashish Asthana, Igor Zinovik, Christian Weinmueller, Dimos Poulikakos
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 141-149, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22830
https://doi.org/10.1115/IHTC14-22830
View Paper titled, Significant Heat Transfer Enhancement in Microchannels With a Segmented Flow of Two Immiscible Liquids
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Drops, Temperature, Water, Heat, Heat sinks, Cooling, Electronics
Proceedings Papers

Convective Air Heat Transfer Through 10 PPI Aluminum Foams

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Simone Mancin, Claudio Zilio, Luisa Rossetto, Alberto Cavallini
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 6, 937-946, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22764
https://doi.org/10.1115/IHTC14-22764
View Paper titled, Convective Air Heat Transfer Through 10 PPI Aluminum Foams
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Topics: Aluminum, Foams (Chemistry), Heat transfer, Heat transfer coefficients, Pressure drop, Pressure gradient, Air flow, Atmospheric pressure, Circuits, Flow (Dynamics)
Proceedings Papers

Generation and Propagation of Thermally Induced Acoustic Waves in Supercritical Fluids: Numerical and Experimental Results

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Bakhtier Farouk, Zhieheng Lei
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 815-826, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22240
https://doi.org/10.1115/IHTC14-22240
View Paper titled, Generation and Propagation of Thermally Induced Acoustic Waves in Supercritical Fluids: Numerical and Experimental Results
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Topics: Acoustics, Supercritical fluids, Waves, Heating, Pressure, Temperature, Supercritical carbon dioxide, Capacitance, Circuits, Computer simulation
Proceedings Papers

Boiling Heat Transfer Surface Capable of Transient Heating and Nucleation Control

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Manabu Tange, Shu Takagi, Fumio Takemura, Masahiro Shoji
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 1, 283-288, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22406
https://doi.org/10.1115/IHTC14-22406
View Paper titled, Boiling Heat Transfer Surface Capable of Transient Heating and Nucleation Control
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Topics: Boiling, Heat transfer, Nucleation (Physics), Transient heat transfer, Bubbles, Heat flux, Emissions, Subcooling, Superheating, Thermocouples
Proceedings Papers

Non-Condensable Gases Effect on Heat Transfer Processes Between Condensing Steam and Boiling Water in Heat Exchanger With Multirow Horizontal Tube Bundle

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A. V. Morozov, O. V. Remizov, A. A. Tsyganok
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 629-635, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22826
https://doi.org/10.1115/IHTC14-22826
View Paper titled, Non-Condensable Gases Effect on Heat Transfer Processes Between Condensing Steam and Boiling Water in Heat Exchanger With Multirow Horizontal Tube Bundle
Open the PDF for Non-Condensable Gases Effect on Heat Transfer Processes Between Condensing Steam and Boiling Water in Heat Exchanger With Multirow Horizontal Tube Bundle in another window
Topics: Boiling, Gases, Heat exchangers, Heat transfer, Steam, Water, Circuits, Condensation, Density, Energy engineering
Proceedings Papers

Picosecond Transient Thermal Imaging Using a CCD Based Thermoreflectance System

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James Christofferson, Kazuaki Yazawa, Ali Shakouri
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 93-97, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22969
https://doi.org/10.1115/IHTC14-22969
View Paper titled, Picosecond Transient Thermal Imaging Using a CCD Based Thermoreflectance System
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Topics: Imaging, Thermoreflectance, Transients (Dynamics), Lasers, Circuits, Heating, Probes, Pumps, Resolution (Optics), Synchronization
Proceedings Papers

Heat Transfer of Supercritical Carbon Dioxide in Printed Circuit Heat Exchanger Geometries

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Alan Kruizenga, Mark Anderson, Roma Fatima, Michael Corradini, Aaron Towne, Devesh Ranjan
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 653-661, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22880
https://doi.org/10.1115/IHTC14-22880
View Paper titled, Heat Transfer of Supercritical Carbon Dioxide in Printed Circuit Heat Exchanger Geometries
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Topics: Circuits, Heat exchangers, Heat transfer, Supercritical carbon dioxide, Carbon dioxide, Brayton cycle, Diffusion (Physics), Fluids, Pressure drop, Wall temperature
Proceedings Papers

Research and Development of Compact Heat Exchangers of Gas Turbine Power Conversion Unit for Nuclear Power Plant With High Temperature Gas-Cooled Reactor

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V. F. Golovko, I. V. Dmitrieva, N. G. Kodochigov
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 4, 513-522, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-22587
https://doi.org/10.1115/IHTC14-22587
View Paper titled, Research and Development of Compact Heat Exchangers of Gas Turbine Power Conversion Unit for Nuclear Power Plant With High Temperature Gas-Cooled Reactor
Open the PDF for Research and Development of Compact Heat Exchangers of Gas Turbine Power Conversion Unit for Nuclear Power Plant With High Temperature Gas-Cooled Reactor in another window
Topics: Energy conversion, Gas turbines, Heat exchangers, Industrial research, Nuclear power stations, Very high temperature reactors, Heat, Design, Circuits, Dimensions
Proceedings Papers

A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications

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Aziz Koyuncuog˘lu, Tuba Okutucu, Haluk Ku¨lah
Proc. ASME. IHTC14, 2010 14th International Heat Transfer Conference, Volume 3, 721-724, August 8–13, 2010
Publisher: American Society of Mechanical Engineers
Paper No: IHTC14-23212
https://doi.org/10.1115/IHTC14-23212
View Paper titled, A CMOS Compatible Metal-Polymer Microchannel Heat Sink for Monolithic Chip Cooling Applications
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Topics: Complementary metal oxide semiconductors, Cooling, Heat sinks, Metals, Microchannels, Polymers, Design, Flow (Dynamics), Circuits, Coolants