The effects of the surface structures and the surface structural clearances at the nanometer scale on the thermal resistance at a liquid water-solid interface, as well as the self-diffusion behaviors of liquid molecules, were investigated directly by the non-equilibrium classical molecular dynamics simulations. When the potential parameter between liquid molecules and nanostructure atoms is equal to that between liquid molecules and solid wall atoms, the geometric surface area change depending on the nanostructures as well as their clearances and the self-diffusion coefficient change of the liquid molecules at the interface depending on the nanostructural clearances cause the thermal resistance change depending on the nanostructures at the liquid-solid interface. When the potential parameter between liquid molecules and nanostructure atoms is different from that between liquid molecules and solid wall atoms, the interfacial thermal resistance is dependent on the potential parameter between liquid molecules and nanostructure atoms itself rather than the geometric surface area in a molecular scale.
Skip Nav Destination
2010 14th International Heat Transfer Conference
August 8–13, 2010
Washington, DC, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4941-5
PROCEEDINGS PAPER
A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface
Masahiko Shibahara,
Masahiko Shibahara
Osaka University, Suita, Osaka, Japan
Search for other works by this author on:
Kiyoshi Takeuchi
Kiyoshi Takeuchi
Osaka University, Suita, Osaka, Japan
Search for other works by this author on:
Masahiko Shibahara
Osaka University, Suita, Osaka, Japan
Kiyoshi Takeuchi
Osaka University, Suita, Osaka, Japan
Paper No:
IHTC14-22152, pp. 293-298; 6 pages
Published Online:
March 1, 2011
Citation
Shibahara, M, & Takeuchi, K. "A Molecular Dynamics Study on the Effects of Nanostructural Clearances on Thermal Resistance at a Liquid-Solid Interface." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 6. Washington, DC, USA. August 8–13, 2010. pp. 293-298. ASME. https://doi.org/10.1115/IHTC14-22152
Download citation file:
11
Views
Related Proceedings Papers
Related Articles
Molecular-Scale Mechanism of Thermal Resistance at the Solid-Liquid Interfaces: Influence of Interaction Parameters Between Solid and Liquid Molecules
J. Heat Transfer (January,2010)
Measurement of Interface Thermal Resistance With Neutron Diffraction
J. Heat Transfer (March,2014)
Constructal Design Applied to the Geometric Optimization of Y-shaped Cavities Embedded in a Conducting Medium
J. Electron. Packag (December,2011)
Related Chapters
Joint Thermal Resistance and Thermal Interface Materials
Thermal Management of Telecommunication Equipment, Second Edition
Resistance Mythology
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
Irreversibility Analysis of Heat Exchanger Network Based on Equivalent Thermal Resistance
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)