A new Charge Coupled Device (CCD) based, full-field thermoreflectance thermal imaging technique is demonstrated with 800 picoseconds temporal resolution. Transient thermal images of pulsed heating in single interconnect vias of 350nm and 550nm in diameter are shown. The use of pulsed laser diodes and dedicated synchronization circuits can significantly lower the cost and the image acquisition time compared to the scanning pump-probe laser systems. Also the same set up can be used to study transient thermal phenomena in a wide dynamic range from sub nanoseconds to seconds.
- Heat Transfer Division
Picosecond Transient Thermal Imaging Using a CCD Based Thermoreflectance System
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Christofferson, J, Yazawa, K, & Shakouri, A. "Picosecond Transient Thermal Imaging Using a CCD Based Thermoreflectance System." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 4. Washington, DC, USA. August 8–13, 2010. pp. 93-97. ASME. https://doi.org/10.1115/IHTC14-22969
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