The development and testing of a new low-profile, air-cooled heat sink for use in cooling electronic modules are presented. This heat sink consists of a micro-groove surface with a special manifold that generated high heat transfer coefficients but low pressure drops. The optimization of the various geometries that make up a micro-grooved heat sink is discussed, as well as the various CFD simulations that were employed to estimate and optimize the thermal performance of a micro-grooved heat sink. The thermal performance of a prototype micro-grooved heat sink is compared with that of a finned heat sink. Other characteristics of the micro-grooved heat sinks will also be contrasted with the finned heat sink.
- Heat Transfer Division
Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink
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Kalinowski, P, Cetegen, E, Dessiatoun, S, & Lawler, J. "Thermal Performance of an Air-Cooled Micro-Grooved Heat Sink." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 741-752. ASME. https://doi.org/10.1115/IHTC14-23326
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