A hybrid cooling scheme for thermal management of hotspots (300–500 W/cm2) in the presence of low background heat flux (100 W/cm2 over 1 cm2) is being investigated. It uses superlattice coolers (SLCs) to remove ultra high power density hotspot and microchannel heat sink for lower background heat flux. In this paper, transient response of the SLC for hotspot removal is studied. The effect of contact resistance, chip thickness, and hotspot size on the performance of the hybrid cooling scheme is also investigated.
- Heat Transfer Division
Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots
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Sahu, V, Joshi, YK, & Fedorov, AG. "Hybrid Superlattice Coolers for Dynamic Thermal Management of Microprocessor Hotspots." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 681-687. ASME. https://doi.org/10.1115/IHTC14-23054
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