The design of a prototype power converter was evaluated and improved using the physics-of-failure based design-for-reliability approach. Thermal simulation of the power module board with the heat sink has been carried out and these results have been used further for estimating the overall thermal cycle reliability. The solder joint reliability has been investigated using two different kinds of solders — SnAgCu (SAC305) and SnPb eutectic solder.
Volume Subject Area:
Electronic Cooling
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