The aim of this work is to present a methodology to develop cost-effective thermal management solutions for microelectronic devices, capable of removing maximum amount of heat and delivering maximally uniform surface temperature distributions. The topological and geometrical characteristics of multiple-story three-dimensional branching networks of microchannels were developed using multi-objective optimization. The design variables which will be subject to optimization in this analysis are the geometric parameters of the microchannel network, i.e. the number of network floors in a 3D network, the amount of branching levels per floor, the connectivity of the cooling channels, their cross-sectional areas and lengths. A conjugate heat transfer analysis software package (CHETSOLP) and an automatic 3D microchannel network generator (3DBNGEN) were developed and coupled with a multi-objective particle-swarm optimization (MOPSO) algorithm with a goal of creating a design tool for 3D networks of optimized coolant flow channels. Numerical algorithms in the conjugate heat transfer solution package include a quasi-1D thermo-fluid solver (COOLNET) and a 3D steady heat diffusion solver, which were validated against results from high-fidelity Navier-Stokes equations solver and analytical solutions for basic fluid dynamics test cases. The conjugate heat transfer solution is achieved by simultaneous prediction of the quasi-1D internal flow-field in the microchannel network and 3D internal temperature field in the solid substrate . Minimization of the pumping power requirement and maximization of total heat removal subject to temperature uniformity (at the heated surface) were the objectives. Pareto-optimal solutions demonstrate that thermal loads of up to 400 W/cm2 can be managed with 3D multi-floor microchannel networks, with pumping power requirements that are up to 50% lower with respect to pumping power requirements in currently used high-performance cooling technologies, such as jet impingement and hybrid impingement-microchannel flow.
- Heat Transfer Division
Optimization of 3D Branching Networks of Microchannels for Microelectronic Device Cooling
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Dulikravich, GS, & Martin, TJ. "Optimization of 3D Branching Networks of Microchannels for Microelectronic Device Cooling." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 503-516. ASME. https://doi.org/10.1115/IHTC14-22719
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