In this paper, experimental investigations of a two-phase thermosyphon loop are presented in order to keep telecommunication equipments temperature below 55°C. The experimental setup consists of a thermosyphon loop containing an evaporator and a condenser connected by two flexible tubes. Tests are performed firstly in transient state using the thermosyphon loop prototype inside telecommunication cabinet. The n-pentane is used as the working fluid. Firstly, transient thermal characteristics of the thermosyphon loop are measured. In the other way, the thermosyphon loop is tested for different power input up to 450W. Operating temperatures of the telecommunication equipments cooled with forced air convection and two-phase thermosyphon loop are compared.
2010 14th International Heat Transfer Conference
August 8–13, 2010
Washington, DC, USA
Conference Sponsors:
- Heat Transfer Division
ISBN:
978-0-7918-4938-5
PROCEEDINGS PAPER
Transient Characteristics of a Two-Phase Thermosyphon Loop for Cooling Telecommunication Outdoor Cabinets
H. Louahlia-Gualous
,
H. Louahlia-Gualous
FEMTO-ST/FCLAB/CNRS, Belfort, France
Search for other works by this author on:
B. Mecheri
,
B. Mecheri
FEMTO-ST/FCLAB/CNRS, Belfort, France
Search for other works by this author on:
D. Nortershauser
,
D. Nortershauser
France Te´le´com, Lannion, France
Search for other works by this author on:
S. Le Masson
S. Le Masson
France Te´le´com, Lannion, France
Search for other works by this author on:
Author Information
H. Louahlia-Gualous
FEMTO-ST/FCLAB/CNRS, Belfort, France
B. Mecheri
FEMTO-ST/FCLAB/CNRS, Belfort, France
D. Nortershauser
France Te´le´com, Lannion, France
S. Le Masson
France Te´le´com, Lannion, France
Paper No:
IHTC14-22218, pp. 467-472; 6 pages
Published Online:
March 1, 2011
Citation
Louahlia-Gualous, H., Mecheri, B., Nortershauser, D., and Le Masson, S. "Transient Characteristics of a Two-Phase Thermosyphon Loop for Cooling Telecommunication Outdoor Cabinets." Proceedings of the 2010 14th International Heat Transfer Conference. 2010 14th International Heat Transfer Conference, Volume 3. Washington, DC, USA. August 8–13, 2010. pp. 467-472. ASME. https://doi.org/10.1115/IHTC14-22218
Download citation file:
- Ris (Zotero)
- Reference Manager
- EasyBib
- Bookends
- Mendeley
- Papers
- EndNote
- RefWorks
- BibTex
- ProCite
- Medlars
Close
Sign In
Related Proceedings Papers
Related Articles
Reviewer's Recognition
J. Electron. Packag (June, 2018)
Overheating and Frequent Thermal Cycling of Outdoor Electronic Cabinets in Cold Climates
J. Electron. Packag (March, 1999)
An Investigation of Flat-Plate Oscillating Heat Pipes
J. Electron. Packag (December, 2010)
Related Chapters
Tempera-Mental Prototypes
Hot Air Rises and Heat Sinks: Everything You Know about Cooling Electronics Is Wrong
System Thermal Analysis—Small Box
Thermal Management of Telecommunications Equipment
Telecom: A Field with Myths and Mistakes All Its Own
More Hot Air