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Proceedings Papers

Proceedings Volume Cover
2010 14th International Heat Transfer Conference
August 8–13, 2010
Washington, DC, USA
Conference Sponsors:
  • Heat Transfer Division
ISBN:
978-0-7918-4938-5
2010 14th International Heat Transfer Conference, Volume 3

Combustion

IHTC 2010; 103-110doi:https://doi.org/10.1115/IHTC14-22466
IHTC 2010; 111-120doi:https://doi.org/10.1115/IHTC14-22469
IHTC 2010; 121-126doi:https://doi.org/10.1115/IHTC14-22509
IHTC 2010; 127-132doi:https://doi.org/10.1115/IHTC14-22553
IHTC 2010; 133-138doi:https://doi.org/10.1115/IHTC14-22566
IHTC 2010; 139-147doi:https://doi.org/10.1115/IHTC14-22658
IHTC 2010; 149-154doi:https://doi.org/10.1115/IHTC14-22668
IHTC 2010; 155-160doi:https://doi.org/10.1115/IHTC14-22742
IHTC 2010; 161-168doi:https://doi.org/10.1115/IHTC14-22777
IHTC 2010; 169-177doi:https://doi.org/10.1115/IHTC14-22800
IHTC 2010; 179-184doi:https://doi.org/10.1115/IHTC14-22819
IHTC 2010; 185-189doi:https://doi.org/10.1115/IHTC14-22832
IHTC 2010; 191-203doi:https://doi.org/10.1115/IHTC14-22908
IHTC 2010; 205-210doi:https://doi.org/10.1115/IHTC14-22938
IHTC 2010; 211-220doi:https://doi.org/10.1115/IHTC14-23061
IHTC 2010; 221-231doi:https://doi.org/10.1115/IHTC14-23068
IHTC 2010; 233-244doi:https://doi.org/10.1115/IHTC14-23121
IHTC 2010; 245-257doi:https://doi.org/10.1115/IHTC14-23155

Conduction

IHTC 2010; 259-266doi:https://doi.org/10.1115/IHTC14-22026
IHTC 2010; 267-273doi:https://doi.org/10.1115/IHTC14-22099
IHTC 2010; 275-284doi:https://doi.org/10.1115/IHTC14-22187
IHTC 2010; 285-291doi:https://doi.org/10.1115/IHTC14-22210
IHTC 2010; 293-297doi:https://doi.org/10.1115/IHTC14-22243
IHTC 2010; 299-304doi:https://doi.org/10.1115/IHTC14-22271
IHTC 2010; 305-312doi:https://doi.org/10.1115/IHTC14-22288
IHTC 2010; 313-316doi:https://doi.org/10.1115/IHTC14-22341
IHTC 2010; 317-320doi:https://doi.org/10.1115/IHTC14-22359
IHTC 2010; 321-326doi:https://doi.org/10.1115/IHTC14-22368
IHTC 2010; 327-334doi:https://doi.org/10.1115/IHTC14-22505
IHTC 2010; 335-340doi:https://doi.org/10.1115/IHTC14-22507
IHTC 2010; 341-350doi:https://doi.org/10.1115/IHTC14-22511
IHTC 2010; 351-360doi:https://doi.org/10.1115/IHTC14-22675
IHTC 2010; 361-370doi:https://doi.org/10.1115/IHTC14-22859
IHTC 2010; 371-380doi:https://doi.org/10.1115/IHTC14-23035
IHTC 2010; 381-386doi:https://doi.org/10.1115/IHTC14-23042
IHTC 2010; 387-396doi:https://doi.org/10.1115/IHTC14-23075
IHTC 2010; 397-404doi:https://doi.org/10.1115/IHTC14-23226
IHTC 2010; 405-416doi:https://doi.org/10.1115/IHTC14-23308

Electronic Cooling

IHTC 2010; 417-423doi:https://doi.org/10.1115/IHTC14-22038
IHTC 2010; 425-430doi:https://doi.org/10.1115/IHTC14-22045
IHTC 2010; 431-439doi:https://doi.org/10.1115/IHTC14-22136
IHTC 2010; 441-448doi:https://doi.org/10.1115/IHTC14-22146
IHTC 2010; 449-458doi:https://doi.org/10.1115/IHTC14-22181
IHTC 2010; 459-465doi:https://doi.org/10.1115/IHTC14-22203
IHTC 2010; 467-472doi:https://doi.org/10.1115/IHTC14-22218
IHTC 2010; 473-480doi:https://doi.org/10.1115/IHTC14-22234
IHTC 2010; 481-493doi:https://doi.org/10.1115/IHTC14-22347
IHTC 2010; 495-501doi:https://doi.org/10.1115/IHTC14-22552
IHTC 2010; 503-516doi:https://doi.org/10.1115/IHTC14-22719
IHTC 2010; 517-522doi:https://doi.org/10.1115/IHTC14-22728
IHTC 2010; 523-533doi:https://doi.org/10.1115/IHTC14-22765
IHTC 2010; 535-545doi:https://doi.org/10.1115/IHTC14-22770
IHTC 2010; 547-555doi:https://doi.org/10.1115/IHTC14-22786
IHTC 2010; 557-563doi:https://doi.org/10.1115/IHTC14-22808
IHTC 2010; 565-574doi:https://doi.org/10.1115/IHTC14-22813
IHTC 2010; 575-583doi:https://doi.org/10.1115/IHTC14-22843
IHTC 2010; 585-592doi:https://doi.org/10.1115/IHTC14-22870
IHTC 2010; 593-601doi:https://doi.org/10.1115/IHTC14-22890
IHTC 2010; 603-610doi:https://doi.org/10.1115/IHTC14-22891
IHTC 2010; 611-618doi:https://doi.org/10.1115/IHTC14-22898
IHTC 2010; 619-628doi:https://doi.org/10.1115/IHTC14-22912
IHTC 2010; 629-635doi:https://doi.org/10.1115/IHTC14-22918
IHTC 2010; 637-648doi:https://doi.org/10.1115/IHTC14-22919
IHTC 2010; 649-655doi:https://doi.org/10.1115/IHTC14-22968
IHTC 2010; 657-664doi:https://doi.org/10.1115/IHTC14-22979
IHTC 2010; 665-669doi:https://doi.org/10.1115/IHTC14-23010
IHTC 2010; 671-674doi:https://doi.org/10.1115/IHTC14-23015
IHTC 2010; 675-680doi:https://doi.org/10.1115/IHTC14-23040
IHTC 2010; 681-687doi:https://doi.org/10.1115/IHTC14-23054
IHTC 2010; 689-699doi:https://doi.org/10.1115/IHTC14-23100
IHTC 2010; 701-709doi:https://doi.org/10.1115/IHTC14-23128
IHTC 2010; 711-719doi:https://doi.org/10.1115/IHTC14-23171
IHTC 2010; 721-724doi:https://doi.org/10.1115/IHTC14-23212
IHTC 2010; 725-732doi:https://doi.org/10.1115/IHTC14-23277
IHTC 2010; 733-740doi:https://doi.org/10.1115/IHTC14-23280
IHTC 2010; 741-752doi:https://doi.org/10.1115/IHTC14-23326

Evaporation

IHTC 2010; 753-768doi:https://doi.org/10.1115/IHTC14-22064
IHTC 2010; 769-776doi:https://doi.org/10.1115/IHTC14-22174
IHTC 2010; 777-782doi:https://doi.org/10.1115/IHTC14-22185
IHTC 2010; 783-790doi:https://doi.org/10.1115/IHTC14-22280
IHTC 2010; 791-796doi:https://doi.org/10.1115/IHTC14-22362
IHTC 2010; 797-802doi:https://doi.org/10.1115/IHTC14-22408
IHTC 2010; 803-808doi:https://doi.org/10.1115/IHTC14-22467
IHTC 2010; 809-814doi:https://doi.org/10.1115/IHTC14-22562
IHTC 2010; 815-821doi:https://doi.org/10.1115/IHTC14-22597
IHTC 2010; 823-826doi:https://doi.org/10.1115/IHTC14-22635
IHTC 2010; 827-834doi:https://doi.org/10.1115/IHTC14-22677
IHTC 2010; 835-844doi:https://doi.org/10.1115/IHTC14-22722
IHTC 2010; 845-851doi:https://doi.org/10.1115/IHTC14-22746
IHTC 2010; 853-860doi:https://doi.org/10.1115/IHTC14-22905
IHTC 2010; 861-869doi:https://doi.org/10.1115/IHTC14-23178
IHTC 2010; 871-876doi:https://doi.org/10.1115/IHTC14-23222
IHTC 2010; 877-883doi:https://doi.org/10.1115/IHTC14-23306

Two-Phase Flow

IHTC 2010; 885-891doi:https://doi.org/10.1115/IHTC14-22056
IHTC 2010; 893-901doi:https://doi.org/10.1115/IHTC14-22265
IHTC 2010; 903-912doi:https://doi.org/10.1115/IHTC14-22576
IHTC 2010; 913-921doi:https://doi.org/10.1115/IHTC14-22588
IHTC 2010; 923-927doi:https://doi.org/10.1115/IHTC14-22636
IHTC 2010; 929-935doi:https://doi.org/10.1115/IHTC14-22649
IHTC 2010; 937-945doi:https://doi.org/10.1115/IHTC14-22698
IHTC 2010; 947-956doi:https://doi.org/10.1115/IHTC14-22758
IHTC 2010; 957-962doi:https://doi.org/10.1115/IHTC14-23174
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