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ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications
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Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 193-202, August 30–September 2, 2009
Paper No: DETC2009-87769
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 109-118, August 30–September 2, 2009
Paper No: DETC2009-87509
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 419-426, August 30–September 2, 2009
Paper No: DETC2009-87508
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 341-346, August 30–September 2, 2009
Paper No: DETC2009-86969
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 273-280, August 30–September 2, 2009
Paper No: DETC2009-87033
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 501-510, August 30–September 2, 2009
Paper No: DETC2009-86337
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 585-594, August 30–September 2, 2009
Paper No: DETC2009-86547
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 281-289, August 30–September 2, 2009
Paper No: DETC2009-87443
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 427-433, August 30–September 2, 2009
Paper No: DETC2009-87610
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 347-356, August 30–September 2, 2009
Paper No: DETC2009-87023
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 119-126, August 30–September 2, 2009
Paper No: DETC2009-87613
Topics: Security, Shells
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 203-208, August 30–September 2, 2009
Paper No: DETC2009-86651
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 511-517, August 30–September 2, 2009
Paper No: DETC2009-86510
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 291-297, August 30–September 2, 2009
Paper No: DETC2009-87611
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 357-364, August 30–September 2, 2009
Paper No: DETC2009-87100
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 209-214, August 30–September 2, 2009
Paper No: DETC2009-86837
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 595-601, August 30–September 2, 2009
Paper No: DETC2009-86725
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 127-134, August 30–September 2, 2009
Paper No: DETC2009-87627
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 435-441, August 30–September 2, 2009
Paper No: DETC2009-87647
Proceedings Papers

Proc. ASME. IDETC-CIE2009, Volume 3: ASME/IEEE 2009 International Conference on Mechatronic and Embedded Systems and Applications; 20th Reliability, Stress Analysis, and Failure Prevention Conference, 519-524, August 30–September 2, 2009
Paper No: DETC2009-86559