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Proceedings Papers

Fabrication of Rotary Comb Drives With Floating Center

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Matteo Verotti, Alvise Bagolini, Leandro Lorenzelli, Rocco Crescenzi, Nicola Pio Belfiore
Proc. ASME. IDETC-CIE2024, Volume 8: 18th International Conference on Micro- and Nanosystems (MNS), V008T08A007, August 25–28, 2024
Publisher: American Society of Mechanical Engineers
Paper No: DETC2024-143428
https://doi.org/10.1115/DETC2024-143428
View Paper titled, Fabrication of Rotary Comb Drives With Floating Center
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Topics: Manufacturing, Linkages, Design, Kinematics, Microelectromechanical systems, Semiconductor wafers, Silicon-on-insulator, Engineering prototypes, Etching, Grasping
Proceedings Papers

Effects of Gas Flow Rates and Sample Position on Carbon-Infiltrated Carbon Nanotube Growth

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Grant Ogilvie, Isaac Harriman, Anton Bowden, Jared Bowden, Brian D. Jensen
Proc. ASME. IDETC-CIE2023, Volume 9: 17th International Conference on Micro- and Nanosystems (MNS), V009T09A005, August 20–23, 2023
Publisher: American Society of Mechanical Engineers
Paper No: DETC2023-116763
https://doi.org/10.1115/DETC2023-116763
View Paper titled, Effects of Gas Flow Rates and Sample Position on Carbon-Infiltrated Carbon Nanotube Growth
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Topics: Carbon, Carbon nanotubes, Gas flow, Chemical vapor deposition, Coatings, Hydrogen, Nanotubes, Flow (Dynamics), Furnaces, Iron
Proceedings Papers

An Radio Frequency Impedance Matching Control Benchmark System for Advanced Control Strategies Evaluation

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Carlos A. Rodríguez, Jairo Viola, YangQuan Chen
Proc. ASME. IDETC-CIE2021, Volume 7: 17th IEEE/ASME International Conference on Mechatronic and Embedded Systems and Applications (MESA), V007T07A004, August 17–19, 2021
Publisher: American Society of Mechanical Engineers
Paper No: DETC2021-70211
https://doi.org/10.1115/DETC2021-70211
View Paper titled, An Radio Frequency Impedance Matching Control Benchmark System for Advanced Control Strategies Evaluation
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Topics: Adaptive control, Algorithms, Control equipment, Control systems, Feedback, Feedforward control, Plasmas (Ionized gases), Reflectance, Robustness, Semiconductor wafers
Proceedings Papers

Simulation of Submicron Particle Deposition in Laminar and Turbulent Stagnation Point Flows

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Salem Abuzeid, Ahmed A. Busnaina
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 565-574, August 18–22, 1991
Publisher: American Society of Mechanical Engineers
Paper No: CIE1991-0070
https://doi.org/10.1115/CIE1991-0070
View Paper titled, Simulation of Submicron Particle Deposition in Laminar and Turbulent Stagnation Point Flows
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Topics: Particulate matter, Simulation, Stagnation flow, Turbulence, Brownian motion, Aerosols, Flow (Dynamics), Fluctuations (Physics), Fluids, Semiconductor wafers
Proceedings Papers

Particle Transport in CVD and Diffusion Processes

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Ahmed Busnaina, Xiaoying Zhu, Xiaowei Zheng
Proc. ASME. CIE92, ASME 1992 International Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computers in Fluid Mechanics/Thermal Systems, 483-490, August 2–6, 1992
Publisher: American Society of Mechanical Engineers
Paper No: CIE1992-0057
https://doi.org/10.1115/CIE1992-0057
View Paper titled, Particle Transport in CVD and Diffusion Processes
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Topics: Chemical vapor deposition, Diffusion processes, Particulate matter, Furnaces, Semiconductor wafers, Aerosols, Diffusion (Physics), Turbulence, Brownian motion, Computation
Proceedings Papers

Design and Fabrication of Microelectromechanical Systems

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G. K. Ananthasuresh, Sridhar Kota, Selden B. Crary, Kensall D. Wise
Proc. ASME. DETC92, 22nd Biennial Mechanisms Conference: Robotics, Spatial Mechanisms, and Mechanical Systems, 251-258, September 13–16, 1992
Publisher: American Society of Mechanical Engineers
Paper No: DETC1992-0222
https://doi.org/10.1115/DETC1992-0222
View Paper titled, Design and Fabrication of Microelectromechanical Systems
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Topics: Design, Manufacturing, Microelectromechanical systems, Blocks (Building materials), Micromachining, Micromechanical devices, Sensors, Boron, Circuits, Dimensions
Proceedings Papers

Mass Transport and Particle Transport in an LPCVD Process

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Bruce S. MacGibbon, Ahmed A. Busnaina
Proc. ASME. CIE93, 13th Computers in Engineering Conference, 213-219, August 8–12, 1993
Publisher: American Society of Mechanical Engineers
Paper No: CIE1993-0027
https://doi.org/10.1115/CIE1993-0027
View Paper titled, Mass Transport and Particle Transport in an LPCVD Process
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Topics: Particulate matter, Contamination, Pressure, Brownian motion, Chemical vapor deposition, Circuits, Dimensions, Drag (Fluid dynamics), Flow (Dynamics), Gravity (Force)
Proceedings Papers

Active Vibration Control of Flexible Space Structures by Using Piezoelectric Sensors and Actuators

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Brij N. Agrawal, Hyochoong Bang
Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration and Control of Mechanical Systems, 169-179, September 19–22, 1993
Publisher: American Society of Mechanical Engineers
Paper No: DETC1993-0232
https://doi.org/10.1115/DETC1993-0232
View Paper titled, Active Vibration Control of Flexible Space Structures by Using Piezoelectric Sensors and Actuators
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Topics: Actuators, Sensors, Space frame structures, Vibration control, Damping, Feedback, Flexible structures, Navy, Piezoelectric actuators, Piezoelectric ceramics
Proceedings Papers

Multiple-Mode Input Shaping Sequences for Reducing Residual Vibrations

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B. Whitney Rappole, Jr., Neil C. Singer, Warren P. Seering
Proc. ASME. DETC94, 23rd Biennial Mechanisms Conference: Machine Elements and Machine Dynamics, 11-16, September 11–14, 1994
Publisher: American Society of Mechanical Engineers
Paper No: DETC1994-0237
https://doi.org/10.1115/DETC1994-0237
View Paper titled, Multiple-Mode Input Shaping Sequences for Reducing Residual Vibrations
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Topics: Vibration, Feedforward control, Flexible structures, Optimization, Robots, Semiconductor wafers
Proceedings Papers

Design Considerations for Manufacturability of MEMS Comb Actuators

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Hrishikesh Dixit, Dean L. Taylor, Srikanth Kannapan
Proc. ASME. DETC-CIE96, Volume 1: Design for Manufacturing Conference, V001T01A047, August 18–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: 96-DETC/DFM-1311
https://doi.org/10.1115/96-DETC/DFM-1311
View Paper titled, Design Considerations for Manufacturability of MEMS Comb Actuators
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Topics: Actuators, Design, Design for Manufacturing, Microelectromechanical systems, Manufacturing, Parametric design, Chemical vapor deposition, Etching, Integrated circuits, Lithography
Proceedings Papers

Removal of Submicron Particles Using High Frequency Ultrasonics

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Ahmed A. Busnaina, Fen Dai
Proc. ASME. DETC-CIE96, Volume 6: 16th Computers in Engineering Conference, V006T06A018, August 18–22, 1996
Publisher: American Society of Mechanical Engineers
Paper No: 96-DETC/CIE-1352
https://doi.org/10.1115/96-DETC/CIE-1352
View Paper titled, Removal of Submicron Particles Using High Frequency Ultrasonics
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Topics: Particulate matter, Ultrasonics, Ultrasonic cleaning, Contamination, Chemical vapor deposition, Integrated circuit fabrication, Reactive-ion etching, Semiconductor wafers, Semiconductors (Materials)
Proceedings Papers

Multivariable Feedback Relevant System Identification of a Wafer Stepper System

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Raymond A. de Callafon, Paul M. J. Van den Hof
Proc. ASME. DETC97, Volume 1A: 16th Biennial Conference on Mechanical Vibration and Noise, V01AT03A014, September 14–17, 1997
Publisher: American Society of Mechanical Engineers
Paper No: DETC97/VIB-4243
https://doi.org/10.1115/DETC97/VIB-4243
View Paper titled, Multivariable Feedback Relevant System Identification of a Wafer Stepper System
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Topics: Feedback, Wafer steppers, Semiconductor wafers, Control equipment, Design, Manufacturing, Robust control
Proceedings Papers

Analytical Modeling for Semiconductor Wafer Fab Environments in Support of Drum-Buffer-Rope Implementation

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Jay Maguire, Jim Hinchman, Steve Luce
Proc. ASME. DETC98, Volume 4: 3rd Design for Manufacturing Conference, V004T04A045, September 13–16, 1998
Publisher: American Society of Mechanical Engineers
Paper No: DETC98/DFM-5751
https://doi.org/10.1115/DETC98/DFM-5751
View Paper titled, Analytical Modeling for Semiconductor Wafer Fab Environments in Support of Drum-Buffer-Rope Implementation
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Topics: Design for Manufacturing, Modeling, Polishing equipment, Ropes, Semiconductor wafers, Manufacturing, Cycles, Equipment performance, Industrial capacity
Proceedings Papers

Slurry Residue Removal in Post Chemical Mechanical Polishing

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Ahmed A. Busnaina, Naim Moumen
Proc. ASME. DETC99, Volume 2: 19th Computers and Information in Engineering Conference, 87-92, September 12–16, 1999
Publisher: American Society of Mechanical Engineers
Paper No: DETC99/CIE-9049
https://doi.org/10.1115/DETC99/CIE-9049
View Paper titled, Slurry Residue Removal in Post Chemical Mechanical Polishing
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Topics: Chemical vapor deposition, Contamination, Oxidation, Particulate matter, Polishing, Semiconductor wafers, Slurries
Proceedings Papers

Microfabrication and Characterization of Electro-Thermal-Compliant Micro Devices

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Jun Li, G. K. Ananthasuresh
Proc. ASME. IDETC-CIE2000, Volume 7A: 26th Biennial Mechanisms and Robotics Conference, 621-633, September 10–13, 2000
Publisher: American Society of Mechanical Engineers
Paper No: DETC2000/MECH-14118
https://doi.org/10.1115/DETC2000/MECH-14118
View Paper titled, Microfabrication and Characterization of Electro-Thermal-Compliant Micro Devices
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Topics: Actuators, Compliant mechanisms, Excimer lasers, Heating, Joules, Materials properties, Metals, Microelectromechanical systems, Microfabrication, Micromachining
Proceedings Papers

Designing a Requirement Driven Product Development Process

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Qi Dong, Daniel E. Whitney
Proc. ASME. IDETC-CIE2001, Volume 4: 13th International Conference on Design Theory and Methodology, 11-20, September 9–12, 2001
Publisher: American Society of Mechanical Engineers
Paper No: DETC2001/DTM-21682
https://doi.org/10.1115/DETC2001/DTM-21682
View Paper titled, Designing a Requirement Driven Product Development Process
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Topics: Design, Product development, Algorithms, Flow (Dynamics), Semiconductor wafers, Systems analysis
Proceedings Papers

Effect of Piezoceramic Hysteresis in Passive and Hybrid Structural Acoustic Control

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M. Bulent Ozer, Thomas J. Royston
Proc. ASME. IDETC-CIE2001, Volume 6B: 18th Biennial Conference on Mechanical Vibration and Noise, 1379-1388, September 9–12, 2001
Publisher: American Society of Mechanical Engineers
Paper No: DETC2001/VIB-21465
https://doi.org/10.1115/DETC2001/VIB-21465
View Paper titled, Effect of Piezoceramic Hysteresis in Passive and Hybrid Structural Acoustic Control
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Topics: Acoustics, Piezoelectric ceramics, Semiconductor wafers, Dimensions, Equations of motion, Modeling
Proceedings Papers

Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton

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Vishnu Aishwaryan Subra Mani, Nathaniel Goldfarb, Gregory S. Fischer
Proc. ASME. IDETC-CIE2020, Volume 9: 40th Computers and Information in Engineering Conference (CIE), V009T09A035, August 17–19, 2020
Publisher: American Society of Mechanical Engineers
Paper No: DETC2020-22444
https://doi.org/10.1115/DETC2020-22444
View Paper titled, Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton
Open the PDF for Design, Development and Characterization of a Wrap Spring Clutch/Brake Mechanism As a Knee Joint for an Assistive Exoskeleton in another window
Topics: Brakes, Design, Exoskeleton devices, Knee, Springs, Robotics, Automotive brakes, Biomechanics, Biomedicine, Performance
Proceedings Papers

Direct Label Free Detection of Orchid Virus Using a Micro/Nano Hybrid Structured Biosensor

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Wei-Jhen Wang, Chia-Hwa Lee, Chin-Wen Li, Stephen Liao, Fuh-Jyh Jan, Gou-Jen Wang
Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A002, August 18–21, 2019
Publisher: American Society of Mechanical Engineers
Paper No: DETC2019-97198
https://doi.org/10.1115/DETC2019-97198
View Paper titled, Direct Label Free Detection of Orchid Virus Using a Micro/Nano Hybrid Structured Biosensor
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Topics: Biosensors, Electrochemical impedance spectroscopy, Electrodes, Ethyl compounds, Integrated circuit fabrication, Self-assembly, Semiconductor wafers, Sensors
Proceedings Papers

Genetically Modified Soybean Detection Using a Biosensor Electrode With Self-Assembled Gold Nanoparticles on a Micro Hemisphere Array

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Ying-Ting Lin, Iren Kuznetsova, Gou-Jen Wang
Proc. ASME. IDETC-CIE2019, Volume 4: 24th Design for Manufacturing and the Life Cycle Conference; 13th International Conference on Micro- and Nanosystems, V004T08A001, August 18–21, 2019
Publisher: American Society of Mechanical Engineers
Paper No: DETC2019-97112
https://doi.org/10.1115/DETC2019-97112
View Paper titled, Genetically Modified Soybean Detection Using a Biosensor Electrode With Self-Assembled Gold Nanoparticles on a Micro Hemisphere Array
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Topics: Biosensors, Electrodes, Nanoparticles, Self-assembly, Semiconductor wafers, Electrochemical impedance spectroscopy, Ethanol, Genetically engineered foods, Photolithography