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Proceedings Papers

Thermal Characteristics of Kickless Welding Cables Using Finite Element Analysis

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James Heist, K. J. Berry
Proc. ASME. CIE91, ASME 1991 Computers in Engineering Conference: Volume 1 — Artificial Intelligence; Expert Systems; CAD/CAM/CAE; Computational Fluid/Thermal Engineering, 667-677, August 18–22, 1991
Publisher: American Society of Mechanical Engineers
Paper No: CIE1991-0084
https://doi.org/10.1115/CIE1991-0084
View Paper titled, Thermal Characteristics of Kickless Welding Cables Using Finite Element Analysis
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Topics: Cables, Finite element analysis, Welding, Copper, Engineering prototypes, Computer simulation, Computer software, Computer-aided design, Computer-aided engineering, Construction
Proceedings Papers

Development of a Houde Damper Using Magnetic Damping

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H. Kobayashi, S. Aida
Proc. ASME. DETC93, 14th Biennial Conference on Mechanical Vibration and Noise: Vibration Isolation, Acoustics, and Damping in Mechanical Systems, 25-29, September 19–22, 1993
Publisher: American Society of Mechanical Engineers
Paper No: DETC1993-0244
https://doi.org/10.1115/DETC1993-0244
View Paper titled, Development of a Houde Damper Using Magnetic Damping
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Topics: Dampers, Damping, Vibration, Vibration suppression, Brakes, Copper, Eddies (Fluid dynamics), Eddy currents (Electricity), Permanent magnets, Pipes
Proceedings Papers

The Effect of Transducer Response Rate on Thermal Radiation Data

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Richard B. Loucks
Proc. ASME. CIE93, 13th Computers in Engineering Conference, 333-337, August 8–12, 1993
Publisher: American Society of Mechanical Engineers
Paper No: CIE1993-0040
https://doi.org/10.1115/CIE1993-0040
View Paper titled, The Effect of Transducer Response Rate on Thermal Radiation Data
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Topics: Thermal radiation, Transducers, Gages, Diaphragms (Mechanical devices), Diaphragms (Structural), Fluence (Radiation measurement), Signals, Copper, Junctions, Radiation (Physics)
Proceedings Papers

A Theoretical Model of Oscillations of Paramagnetic or Diamagnetic Structures Subject to Passive Magnetic Elements

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Bruno A. D. Piombo, Elvio Bonisoli, Massimo Ruzzene
Proc. ASME. IDETC-CIE2001, Volume 6C: 18th Biennial Conference on Mechanical Vibration and Noise, 3069-3077, September 9–12, 2001
Publisher: American Society of Mechanical Engineers
Paper No: DETC2001/VIB-21737
https://doi.org/10.1115/DETC2001/VIB-21737
View Paper titled, A Theoretical Model of Oscillations of Paramagnetic or Diamagnetic Structures Subject to Passive Magnetic Elements
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Topics: Aluminum, Brass (Metal), Circuits, Copper, Currents, Damping, Degrees of freedom, Dynamic response, Eddies (Fluid dynamics), Magnetic fields
Proceedings Papers

Molecular Dynamics Simulations on the Tensile Deformation and Failure of a Polyethylene/Copper Interface

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Lijuan Liao, Changyu Meng, Chenguang Huang
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T08A017, August 26–29, 2018
Publisher: American Society of Mechanical Engineers
Paper No: DETC2018-85504
https://doi.org/10.1115/DETC2018-85504
View Paper titled, Molecular Dynamics Simulations on the Tensile Deformation and Failure of a Polyethylene/Copper Interface
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Topics: Copper, Failure, Molecular dynamics simulation, Tensile deformation, Failure mechanisms, Damage, Yield strength, Atoms, Bonding, Chain
Proceedings Papers

Performance Analysis of Rapid Tool in Electrical Discharge Machining During Machining of Titanium Alloy (Ti6Al4V)

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Anshuman Kumar Sahu, Siba Sankar Mahapatra
Proc. ASME. IDETC-CIE2018, Volume 4: 23rd Design for Manufacturing and the Life Cycle Conference; 12th International Conference on Micro- and Nanosystems, V004T05A016, August 26–29, 2018
Publisher: American Society of Mechanical Engineers
Paper No: DETC2018-85489
https://doi.org/10.1115/DETC2018-85489
View Paper titled, Performance Analysis of Rapid Tool in Electrical Discharge Machining During Machining of Titanium Alloy (Ti6Al4V)
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Topics: Electrical discharge machining, Machining, Titanium alloys, Electrodes, Alloys, Titanium, Additive manufacturing, Aerospace industry, Biomedicine, Brass (Metal)
Proceedings Papers

Process Design and Control Method of Laser Via Hole Drilling of Printed Wiring Boards Based on High Speed Camera Monitor

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Koji Kanki, Toshiki Hirogaki, Eiichi Aoyama, Keiji Ogawa
Proc. ASME. IDETC-CIE2017, Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems, V004T05A022, August 6–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: DETC2017-67223
https://doi.org/10.1115/DETC2017-67223
View Paper titled, Process Design and Control Method of Laser Via Hole Drilling of Printed Wiring Boards Based on High Speed Camera Monitor
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Topics: Drilling, Lasers, Printed circuit boards, Process design, Copper foil, Drills (Tools), Electromagnetic scattering, Radiation scattering, Scattering (Physics), Carbon dioxide lasers
Proceedings Papers

Conceptual Regenerative Nozzle Cooling Design for a Hydroxyl-Terminated Polybutadiene and Oxygen Hybrid Rocket Engine

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Luis R. Robles, Johnny Ho, Bao Nguyen, Geoffrey Wagner, Jeremy Surmi, Khulood Faruqui, Ashley Carter, Tom Hinz, Fady Kakish, Zachariah Zousel, Kory Matthys, Joseph Piacenza
Proc. ASME. IDETC-CIE2017, Volume 4: 22nd Design for Manufacturing and the Life Cycle Conference; 11th International Conference on Micro- and Nanosystems, V004T05A046, August 6–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: DETC2017-68396
https://doi.org/10.1115/DETC2017-68396
View Paper titled, Conceptual Regenerative Nozzle Cooling Design for a Hydroxyl-Terminated Polybutadiene and Oxygen Hybrid Rocket Engine
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Topics: Cooling, Design, Nozzles, Oxygen, Polybutadiene rubber, Rocket engines, Rockets, Ablation (Vaporization technology), Combustion, Combustion chambers
Proceedings Papers

A Novel Micro Heater Integrated on Flexible Polyimide Substrate With Fast Response and Uniform Temperature Distribution

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Shifeng Yu, Shuyu Wang, Ming Lu, Lei Zuo
Proc. ASME. IDETC-CIE2015, Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems, V004T09A023, August 2–5, 2015
Publisher: American Society of Mechanical Engineers
Paper No: DETC2015-46278
https://doi.org/10.1115/DETC2015-46278
View Paper titled, A Novel Micro Heater Integrated on Flexible Polyimide Substrate With Fast Response and Uniform Temperature Distribution
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Topics: Temperature distribution, Thin films, Heating, High temperature, Temperature, Copper, Electrical resistivity, Energy consumption, Finite element analysis, Hardening (Curing)
Proceedings Papers

Fatigue Test for Thick Wire Bonds

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Turker Dagdelen, Karim El-Rayes, Sangtak Park, Mahmoud Khater, Resul Saritas, Eihab Abdel-Rahman, Mustafa Yavuz
Proc. ASME. IDETC-CIE2014, Volume 8: 26th Conference on Mechanical Vibration and Noise, V008T11A010, August 17–20, 2014
Publisher: American Society of Mechanical Engineers
Paper No: DETC2014-35190
https://doi.org/10.1115/DETC2014-35190
View Paper titled, Fatigue Test for Thick Wire Bonds
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Topics: Fatigue testing, Wire, Aluminum, Bonding, Bridges (Structures), Copper, Cycles, Durability, Failure, Fatigue
Proceedings Papers

Design of Thin Film Solar Cell Material Structures for Reliability and Performance Robustness

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Nita Yodo, Pingfeng Wang
Proc. ASME. IDETC-CIE2013, Volume 3A: 39th Design Automation Conference, V03AT03A019, August 4–7, 2013
Publisher: American Society of Mechanical Engineers
Paper No: DETC2013-12611
https://doi.org/10.1115/DETC2013-12611
View Paper titled, Design of Thin Film Solar Cell Material Structures for Reliability and Performance Robustness
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Topics: Design, Reliability, Robustness, Solar cells, Thin films, Stability, Copper, Energy gap, Gallium, Manufacturing
Proceedings Papers

Estimation of Long-Term Copper Demand Based on Sustainability Scenarios: A Challenge to Sustainable Manufacturing Industry

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Yusuke Kishita, Yuta Inoue, Shinichi Fukushige, Yasushi Umeda, Hideki Kobayashi
Proc. ASME. IDETC-CIE2012, Volume 5: 6th International Conference on Micro- and Nanosystems; 17th Design for Manufacturing and the Life Cycle Conference, 743-751, August 12–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: DETC2012-70695
https://doi.org/10.1115/DETC2012-70695
View Paper titled, Estimation of Long-Term Copper Demand Based on Sustainability Scenarios: A Challenge to Sustainable Manufacturing Industry
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Topics: Copper, Manufacturing industry, Sustainability, Electric vehicles, Carbon, Photovoltaic power systems, Base metals, Climate change, Developing nations, Emissions
Proceedings Papers

Mechanical Behavior Analysis of Micro-Scaled Functionally Graded Timoshenko Beams by the Strain Gradient Theory

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S. A. Tajalli, M. H. Kahrobaiyan, M. Rahaeifard, M. T. Ahmadian, M. R. Movahhedy, J. Akbari
Proc. ASME. IDETC-CIE2012, Volume 5: 6th International Conference on Micro- and Nanosystems; 17th Design for Manufacturing and the Life Cycle Conference, 67-73, August 12–15, 2012
Publisher: American Society of Mechanical Engineers
Paper No: DETC2012-70317
https://doi.org/10.1115/DETC2012-70317
View Paper titled, Mechanical Behavior Analysis of Micro-Scaled Functionally Graded Timoshenko Beams by the Strain Gradient Theory
Open the PDF for Mechanical Behavior Analysis of Micro-Scaled Functionally Graded Timoshenko Beams by the Strain Gradient Theory in another window
Topics: Mechanical behavior, Strain gradient, Functionally graded materials, Boundary-value problems, Copper, Deformation, Differential equations, Equilibrium (Physics), Microbeams, Simply supported beams
Proceedings Papers

Thermal Modeling for Control of Friction Stir Welding Process in Automated Manufacturing

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Iraj Mantegh
Proc. ASME. IDETC-CIE2011, Volume 9: 23rd International Conference on Design Theory and Methodology; 16th Design for Manufacturing and the Life Cycle Conference, 763-768, August 28–31, 2011
Publisher: American Society of Mechanical Engineers
Paper No: DETC2011-48774
https://doi.org/10.1115/DETC2011-48774
View Paper titled, Thermal Modeling for Control of Friction Stir Welding Process in Automated Manufacturing
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Topics: Friction, Manufacturing, Modeling, Welding, Aluminum, Joining, Temperature, Artificial neural networks, Aerospace industry, Control equipment
Proceedings Papers

Performance of Injection-Molded Plastic Helical Gears Finished by Hot Rolling

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Morimasa Nakamura, Atsushi Katayama, Ichiro Moriwaki
Proc. ASME. IDETC-CIE2011, Volume 8: 11th International Power Transmission and Gearing Conference; 13th International Conference on Advanced Vehicle and Tire Technologies, 491-495, August 28–31, 2011
Publisher: American Society of Mechanical Engineers
Paper No: DETC2011-47426
https://doi.org/10.1115/DETC2011-47426
View Paper titled, Performance of Injection-Molded Plastic Helical Gears Finished by Hot Rolling
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Topics: Errors, Finishing, Gears, Helical gears, Hot rolling, Injection molded plastics, Plastic gears, Stress, Copper, Fatigue
Proceedings Papers

Analysis of Electrical Discharge Machining Using Water as Dielectric and Diverse Electrode Materials

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Hugo Medellin, Aaro´n Flores, Jorge Morales, Alonso de la Garza
Proc. ASME. IDETC-CIE2008, Volume 5: 13th Design for Manufacturability and the Lifecycle Conference; 5th Symposium on International Design and Design Education; 10th International Conference on Advanced Vehicle and Tire Technologies, 201-207, August 3–6, 2008
Publisher: American Society of Mechanical Engineers
Paper No: DETC2008-49108
https://doi.org/10.1115/DETC2008-49108
View Paper titled, Analysis of Electrical Discharge Machining Using Water as Dielectric and Diverse Electrode Materials
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Topics: Electrical discharge machining, Electrodes, Water, Brass (Metal), Bronze, Steel, Aluminum, ASTM International, Carbon, Copper
Proceedings Papers

A Single Piezoelectric Trimorph Driven Bi-Directional Linear Ultrasonic Motor

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Tung-Li Wu, Chen-Hui Yang, Shuo-Hung Chang
Proc. ASME. IDETC-CIE2007, Volume 8: 31st Mechanisms and Robotics Conference, Parts A and B, 291-296, September 4–7, 2007
Publisher: American Society of Mechanical Engineers
Paper No: DETC2007-34661
https://doi.org/10.1115/DETC2007-34661
View Paper titled, A Single Piezoelectric Trimorph Driven Bi-Directional Linear Ultrasonic Motor
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Topics: Ultrasonic motors, Vibration, Resonance, Design, Engines, Motors, Actuators, Copper, Engineering prototypes, Finite element analysis
Proceedings Papers

Controlling Droplet Vaporization/Condensation for Liquid Supply of Capillary-Based Micromanipulation

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Kenichi J. Obata, Shin-Ichi Masunari, Shigeki Saito, Kunio Takahashi
Proc. ASME. IDETC-CIE2007, Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B, 851-854, September 4–7, 2007
Publisher: American Society of Mechanical Engineers
Paper No: DETC2007-35284
https://doi.org/10.1115/DETC2007-35284
View Paper titled, Controlling Droplet Vaporization/Condensation for Liquid Supply of Capillary-Based Micromanipulation
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Topics: Condensation, Drops, Micromanipulation, Temperature, Copper, Design, Heat, Image processing
Proceedings Papers

Nonlinear Vibrations of an Inclined Cable

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A. Berlioz, C.-H. Lamarque
Proc. ASME. IDETC-CIE2003, Volume 5: 19th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 2575-2584, September 2–6, 2003
Publisher: American Society of Mechanical Engineers
Paper No: DETC2003/VIB-48616
https://doi.org/10.1115/DETC2003/VIB-48616
View Paper titled, Nonlinear Vibrations of an Inclined Cable
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Topics: Cables, Vibration, Wire, Construction, Copper, Degrees of freedom, Dynamic models, Steel
Proceedings Papers

Modeling and Free Vibration of Flex Circuits in Hard Disk Drives

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Jonathan Wickert
Proc. ASME. IDETC-CIE2003, Volume 5: 19th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 2325-2333, September 2–6, 2003
Publisher: American Society of Mechanical Engineers
Paper No: DETC2003/VIB-48583
https://doi.org/10.1115/DETC2003/VIB-48583
View Paper titled, Modeling and Free Vibration of Flex Circuits in Hard Disk Drives
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Topics: Disks, Flexible electronics, Free vibrations, Modeling, Circuits, Shapes, Vibration, Equilibrium (Physics), Adhesives, Copper