In this article, C-STEM Studio, a platform for hands-on integrated learning of Computing, Science, Technology, Engineering and Mathematics (STEM) with robotics, is presented. C-STEM Studio integrates many technologies, software, and curriculum that K-12 educators can use in their classroom. Ch, a C/C++ interpreter, provides an environment for computing. Linkbot Labs, Ch Linkbot Controller, and Ch Robot Controller allow teachers to utilize the robotics, such as Linkbots and Lego Mindstorms NXT and EV3, to help teach concepts in mathematics and science. RoboSim and RoboBlockly are simulation environments that allow students without physical robots to learn with virtual robots. Teachers can also teach embedded systems with Ch Arduino package, designed atop Ch. Also, easy-to-use resources explorers are built in the C-STEM Studio so that teachers and students can access teaching resources, students homework and materials come with those software. Finally, we provided a solution for Chromebook users to run C-STEM Studio through Raspberry Pi.
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ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 6–9, 2017
Cleveland, Ohio, USA
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-5823-3
PROCEEDINGS PAPER
C-STEM Studio: A Solution for Learning Computing and STEM Topics With Robotics and Embedded Systems
Binsen Qian,
Binsen Qian
University of California at Davis, Davis, CA
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Harry H. Cheng
Harry H. Cheng
University of California at Davis, Davis, CA
Search for other works by this author on:
Binsen Qian
University of California at Davis, Davis, CA
Harry H. Cheng
University of California at Davis, Davis, CA
Paper No:
DETC2017-68362, V009T07A041; 8 pages
Published Online:
November 3, 2017
Citation
Qian, B, & Cheng, HH. "C-STEM Studio: A Solution for Learning Computing and STEM Topics With Robotics and Embedded Systems." Proceedings of the ASME 2017 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 9: 13th ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications. Cleveland, Ohio, USA. August 6–9, 2017. V009T07A041. ASME. https://doi.org/10.1115/DETC2017-68362
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