Conventional capacitive sensing places significant limitations on the sensor design due to the pull-in instability caused by the electrostatic force. The main purpose of this study is to examine a low-cost novel capacitive sensing principle based on electrostatic balance which promises to avoid these design limitations. The approach uses an asymmetric electric field on a structure with fingers that can generate a repulsive force while the gap is low and create an attractive force while the gap is large. The size and thickness of the fingers are also responsible for creating repulsive or attractive forces on the structure. This approach has recently been applied successfully in the design of capacitive actuators to provide a repulsive driving force. A new design principle for capacitive sensing is described that avoids pull-in instability by designing the fingers such that the structure is at the equilibrium.
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ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 2–5, 2015
Boston, Massachusetts, USA
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-5711-3
PROCEEDINGS PAPER
A Novel Capacitive Sensing Principle for Microdevices Available to Purchase
Jian Zhou,
Jian Zhou
State University of New York at Binghamton, Binghamton, NY
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Ronald N. Miles,
Ronald N. Miles
State University of New York at Binghamton, Binghamton, NY
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Shahrzad Towfighian
Shahrzad Towfighian
State University of New York at Binghamton, Binghamton, NY
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Jian Zhou
State University of New York at Binghamton, Binghamton, NY
Ronald N. Miles
State University of New York at Binghamton, Binghamton, NY
Shahrzad Towfighian
State University of New York at Binghamton, Binghamton, NY
Paper No:
DETC2015-46554, V004T09A024; 6 pages
Published Online:
January 19, 2016
Citation
Zhou, J, Miles, RN, & Towfighian, S. "A Novel Capacitive Sensing Principle for Microdevices." Proceedings of the ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 20th Design for Manufacturing and the Life Cycle Conference; 9th International Conference on Micro- and Nanosystems. Boston, Massachusetts, USA. August 2–5, 2015. V004T09A024. ASME. https://doi.org/10.1115/DETC2015-46554
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