The aim of this paper is to introduce an approach for optimally organizing a variety of different unit cell designs within a large lattice such that the bulk behavior of the lattice exhibits a desired Young’s modulus with a graded change in thermal expansion over its geometry. This lattice, called a graded microarchitectured material, can be sandwiched between two other materials with different thermal expansion coefficients to accommodate their different expansions or contractions caused by changing temperature while achieving a desired uniform stiffness. First, this paper provides the theory necessary to calculate the thermal expansion and Young’s modulus of large multi-material lattices that consist of periodic (i.e., repeating) unit cells of the same design. Then it introduces the theory for calculating the graded thermal expansions of a large multimaterial lattice that consists of non-periodic unit cells of different designs. An approach is then provided for optimally designing and organizing different unit cells within a lattice such that both of its ends achieve the same thermal expansion as the two materials between which the lattice is sandwiched. A MATLAB tool is used to generate images of the undeformed and deformed lattices to verify their behavior and various examples are provided as case studies. The theory provided is also verified and validated using finite element analysis and experimentation.
Skip Nav Destination
ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 2–5, 2015
Boston, Massachusetts, USA
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-5708-3
PROCEEDINGS PAPER
Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions
Jonathan B. Hopkins,
Jonathan B. Hopkins
University of California, Los Angeles, Los Angeles, CA
Search for other works by this author on:
Lucas A. Shaw,
Lucas A. Shaw
University of California, Los Angeles, Los Angeles, CA
Search for other works by this author on:
Todd H. Weisgraber,
Todd H. Weisgraber
Lawrence Livermore National Laboratory, Livermore, CA
Search for other works by this author on:
George R. Farquar,
George R. Farquar
Lawrence Livermore National Laboratory, Livermore, CA
Search for other works by this author on:
Christopher D. Harvey,
Christopher D. Harvey
Lawrence Livermore National Laboratory, Livermore, CA
Search for other works by this author on:
Christopher M. Spadaccini
Christopher M. Spadaccini
Lawrence Livermore National Laboratory, Livermore, CA
Search for other works by this author on:
Jonathan B. Hopkins
University of California, Los Angeles, Los Angeles, CA
Lucas A. Shaw
University of California, Los Angeles, Los Angeles, CA
Todd H. Weisgraber
Lawrence Livermore National Laboratory, Livermore, CA
George R. Farquar
Lawrence Livermore National Laboratory, Livermore, CA
Christopher D. Harvey
Lawrence Livermore National Laboratory, Livermore, CA
Christopher M. Spadaccini
Lawrence Livermore National Laboratory, Livermore, CA
Paper No:
DETC2015-46638, V02BT03A005; 11 pages
Published Online:
January 19, 2016
Citation
Hopkins, JB, Shaw, LA, Weisgraber, TH, Farquar, GR, Harvey, CD, & Spadaccini, CM. "Organizing Cells Within Non-Periodic Microarchitectured Materials That Achieve Graded Thermal Expansions." Proceedings of the ASME 2015 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 2B: 41st Design Automation Conference. Boston, Massachusetts, USA. August 2–5, 2015. V02BT03A005. ASME. https://doi.org/10.1115/DETC2015-46638
Download citation file:
24
Views
Related Proceedings Papers
Related Articles
Reliability Analysis of Flip Chip Designs Via Computer Simulation
J. Electron. Packag (September,2000)
Combining Variation Simulation With Thermal Expansion Simulation for Geometry Assurance
J. Comput. Inf. Sci. Eng (September,2013)
Shearing Deformation in Partial Areal Arrays: Analytical Results
J. Electron. Packag (March,1998)
Related Chapters
Compare the Results of Comsol Multiphysics Software and Matlab Pdetool in Finite Element Analysis of the Diffusiion Equation
International Conference on Computer Engineering and Technology, 3rd (ICCET 2011)
Introduction and Definitions
Handbook on Stiffness & Damping in Mechanical Design
Piping Design
Power Boilers: A Guide to the Section I of the ASME Boiler and Pressure Vessel Code, Second Edition