Thick bonding wires used in power modules experience a wide range of temperature and mechanical load cycling conditions. This leads to cracks at the wire heel due to fatigue. In this study, a new type of thick wire bonds, Aluminum coated copper, was subjected to fatigue test to investigate its durability. Unlike traditional thermal cycling, this test involves applying a pattern of repetitive prescribed displacements to a wire foot while fatigue failure is detected via a Wheatstone bridge. The aim is to compare different wire materials to the number-of-cycles-to-failure, thereby quantifying the reliability and life time of thick wire bond.

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