Products evolve over time to follow new customer needs and technologies. Although the proper estimation of future products has been regarded as a critical issue for business success, it has not been widely discussed in an analytical way. Focusing on the evolution of a product family, this paper aims to develop a dynamic model which can effectively show the structural changes of a product family over time. The proposed model is based on a network representing the structural architecture of a product family. This model employs the concept of Fitness Model [1], where nodes in a certain system have their own fitness values to represent the degree of gaining edges with new nodes. The dynamic model proposed in this paper would be a basis for the estimation of product family evolution; it is potentially effective to simulate possible future structures of a product family according to different platform leveraging strategies.
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ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 17–20, 2014
Buffalo, New York, USA
Conference Sponsors:
- Design Engineering Division
- Computers and Information in Engineering Division
ISBN:
978-0-7918-4635-3
PROCEEDINGS PAPER
A Network Based Dynamic Model for Product Family Evolution Available to Purchase
Kijung Park,
Kijung Park
The Pennsylvania State University, University Park, PA
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Gül E. Okudan Kremer
Gül E. Okudan Kremer
The Pennsylvania State University, University Park, PA
Search for other works by this author on:
Kijung Park
The Pennsylvania State University, University Park, PA
Gül E. Okudan Kremer
The Pennsylvania State University, University Park, PA
Paper No:
DETC2014-35446, V004T06A027; 8 pages
Published Online:
January 13, 2015
Citation
Park, K, & Okudan Kremer, GE. "A Network Based Dynamic Model for Product Family Evolution." Proceedings of the ASME 2014 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 19th Design for Manufacturing and the Life Cycle Conference; 8th International Conference on Micro- and Nanosystems. Buffalo, New York, USA. August 17–20, 2014. V004T06A027. ASME. https://doi.org/10.1115/DETC2014-35446
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