In this paper, comparisons of the design optimization of ball grid array packaging geometry based on the elastic and viscoelastic material properties are made. Six geometric dimensions of the packaging are chosen as input variables. Molding compound and substrate are modeled as elastic and viscoelastic, respectively. Viscoplastic finite element analyses are performed to calculate the strain energy densities (SED) of the eutectic solder balls. Robust design optimizations to minimize SED are carried out, which accounts for the variance of the parameters via Kriging dimension reduction method. Optimum solutions are compared with those by the Taguchi method. It is found that the effects of the packaging geometry on the solder ball reliability are significant, and the optimization results are different depending on the materials modeling.
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ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 28–31, 2011
Washington, DC, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
978-0-7918-5482-2
PROCEEDINGS PAPER
Robust Design Optimization of Ball Grid Array Packaging
Jae Chang Kim,
Jae Chang Kim
Korea Aerospace University, Goyang, Gyeonggi, South Korea
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Joo-Ho Choi,
Joo-Ho Choi
Korea Aerospace University, Goyang, Gyeonggi, South Korea
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Yeong K. Kim
Yeong K. Kim
Korea Aerospace University, Goyang, Gyeonggi, South Korea
Search for other works by this author on:
Jae Chang Kim
Korea Aerospace University, Goyang, Gyeonggi, South Korea
Joo-Ho Choi
Korea Aerospace University, Goyang, Gyeonggi, South Korea
Yeong K. Kim
Korea Aerospace University, Goyang, Gyeonggi, South Korea
Paper No:
DETC2011-48858, pp. 165-171; 7 pages
Published Online:
June 12, 2012
Citation
Kim, JC, Choi, J, & Kim, YK. "Robust Design Optimization of Ball Grid Array Packaging." Proceedings of the ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 5: 37th Design Automation Conference, Parts A and B. Washington, DC, USA. August 28–31, 2011. pp. 165-171. ASME. https://doi.org/10.1115/DETC2011-48858
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