Intellectual Property (IP) leakage during collaborative product development is drawing more and more attentions nowadays. Unlike most of existing research, which is focused on the effect of IP leakage on the supply chain’s material and information flows, we propose a reverse design based conceptual model of information leakage during collaborative product development environments. In addition, a generic extensible framework is proposed to detect and estimate the IP leakage due to reverse design. Specifically, we propose an inference model to obtain inferred knowledge based on public knowledge and shared knowledge. We also present an algorithm to detect potential IP leakage due to reverse design in collaborative product development environments when potential competition may exist between a product partner and the manufacturer. An industrial example is used to demonstrate the problem and our proposed approach.
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ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 28–31, 2011
Washington, DC, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
978-0-7918-5479-2
PROCEEDINGS PAPER
Detecting Risk of Intellectual Property (IP) Leakage due to Reverse Design in Collaborative Product Development Environments
Xinlin Cao,
Xinlin Cao
Concordia University, Montre´al, QC, Canada
Search for other works by this author on:
Yong Zeng
Yong Zeng
Concordia University, Montre´al, QC, Canada
Search for other works by this author on:
Xinlin Cao
Concordia University, Montre´al, QC, Canada
Yong Zeng
Concordia University, Montre´al, QC, Canada
Paper No:
DETC2011-48278, pp. 1389-1399; 11 pages
Published Online:
June 12, 2012
Citation
Cao, X, & Zeng, Y. "Detecting Risk of Intellectual Property (IP) Leakage due to Reverse Design in Collaborative Product Development Environments." Proceedings of the ASME 2011 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 2: 31st Computers and Information in Engineering Conference, Parts A and B. Washington, DC, USA. August 28–31, 2011. pp. 1389-1399. ASME. https://doi.org/10.1115/DETC2011-48278
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