We are developing a new technique, called nanoinjection, to insert foreign DNA into a living cell. Such DNA transfection is commonly used to create transgenic organisms vital to the study of genetics, immunology, and many other biological sciences. In nanoinjection, DNA, which has a net negative charge, is electrostatically attracted to a micromachined lance. The lance then pierces the cell membranes, and the voltage on the lance is reversed, repelling the DNA into the cell. This paper presents a mathematical model to predict the motion (trajectory) of DNA particles within a cell in the presence of the electric field developed by the lance and the substrate. The model is used to predict the scattering of DNA through the cell due to electrostatic repulsion. We are currently preparing experiments which will be used to validate the model.
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ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 30–September 2, 2009
San Diego, California, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4903-3
PROCEEDINGS PAPER
Modeling DNA Motion Under Electrostatic Repulsion Within a Living Cell
Regis A. David,
Regis A. David
Brigham Young University, Provo, UT
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Brian D. Jensen
Brian D. Jensen
Brigham Young University, Provo, UT
Search for other works by this author on:
Regis A. David
Brigham Young University, Provo, UT
Brian D. Jensen
Brigham Young University, Provo, UT
Paper No:
DETC2009-87413, pp. 415-421; 7 pages
Published Online:
July 29, 2010
Citation
David, RA, & Jensen, BD. "Modeling DNA Motion Under Electrostatic Repulsion Within a Living Cell." Proceedings of the ASME 2009 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 6: ASME Power Transmission and Gearing Conference; 3rd International Conference on Micro- and Nanosystems; 11th International Conference on Advanced Vehicle and Tire Technologies. San Diego, California, USA. August 30–September 2, 2009. pp. 415-421. ASME. https://doi.org/10.1115/DETC2009-87413
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