In this study, a process planning method is presented for the Mask Projection Micro-Stereolithography process with the ability to cure a film of various thicknesses on flat or curved transparent substrates. In this process, incident radiation, patterned by a dynamic mask, passes through a transparent substrate to cure photopolymer resin layers that grow progressively from the substrate surface. When compared to existing Stereolithography techniques, this technique eliminates the necessity of recoating, reducing process time and improving accuracy. A regression model is adopted in this process plan to accurately control the curing front on the substrate. An existing Mask Projection Micro-Stereolithography process planning method is extended to account for radiation transmission through the substrate. The models are verified using experiments.

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