Lead Zirconate Titanate Oxide (PbZrxTi1−xO3 or PZT) is a piezoelectric material widely used as sensors and actuators. For microactuators, PZT often appears in the form of thin films to maintain proper aspect ratios. A common design is PZT membrane microactuator, whose actuation portion takes a form of a thin diaphragm driven by a PZT thin film. To maximize actuation displacements, finite element analyses are conducted to identify critical design parameters of the PZT film. In the simulation, a constant driving electric field is maintained and boundary conditions of the PZT film are varied. The finite element analyses lead to two important results. First, the actuator displacement increases as the PZT film thickness increases, but saturates at a critical PZT film thickness. Second, when stress relief grooves are introduced and the PZT film surrounding the membrane area is removed, the actuator displacement increases substantially by at least a factor of 5.
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ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 3–6, 2008
Brooklyn, New York, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4328-4
PROCEEDINGS PAPER
Actuation Enhancement of PZT Thin-Film Membrane Actuators via Stress Relief Grooves
Cheng-Chun Lee,
Cheng-Chun Lee
University of Washington, Seattle, WA
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G. Z. Cao,
G. Z. Cao
University of Washington, Seattle, WA
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I. Y. Shen
I. Y. Shen
University of Washington, Seattle, WA
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Cheng-Chun Lee
University of Washington, Seattle, WA
G. Z. Cao
University of Washington, Seattle, WA
I. Y. Shen
University of Washington, Seattle, WA
Paper No:
DETC2008-49283, pp. 613-617; 5 pages
Published Online:
July 13, 2009
Citation
Lee, C, Cao, GZ, & Shen, IY. "Actuation Enhancement of PZT Thin-Film Membrane Actuators via Stress Relief Grooves." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: 20th International Conference on Design Theory and Methodology; Second International Conference on Micro- and Nanosystems. Brooklyn, New York, USA. August 3–6, 2008. pp. 613-617. ASME. https://doi.org/10.1115/DETC2008-49283
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