This paper presents a Solid modeling methodology for finding Cutter Workpiece Engagements (CWEs) generated during 3+2 -axis machining (spindle can tilt) of free – form surfaces using a range of different types of cutting tools and tool paths. Swept volumes of the cutters are generated utilizing the envelope theory. For the CWE extractions the removal volumes of the cutter constituent surfaces are used. For this purpose the cutter surfaces are decomposed with respect to the tool feed direction and then they intersected with their removal volumes for obtaining the boundary curves of the closed CWE area. The CWE boundary curves are mapped from Euclidean space to a parametric space defined by the engagement angle and the depth-of-cut for a given tool geometry. The reported method has been implemented using a commercial geometric modeler (ACIS) which is selected to be the kernel around which the geometric simulator is built. The described geometric methodology is being developed as part of a Virtual Milling methodology that combines the geometric modeling aspects of milling material removal with the modeling of the process.
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ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 3–6, 2008
Brooklyn, New York, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4327-7
PROCEEDINGS PAPER
A Solid Modeler Approach for Extracting Cutter Workpiece Engagements in Milling Available to Purchase
Eyyup Aras,
Eyyup Aras
University of British Columbia, Vancouver, BC, Canada
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Derek Yip-Hoi
Derek Yip-Hoi
Western Washington University, Bellingham, WA
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Eyyup Aras
University of British Columbia, Vancouver, BC, Canada
Derek Yip-Hoi
Western Washington University, Bellingham, WA
Paper No:
DETC2008-49598, pp. 209-221; 13 pages
Published Online:
July 13, 2009
Citation
Aras, E, & Yip-Hoi, D. "A Solid Modeler Approach for Extracting Cutter Workpiece Engagements in Milling." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B. Brooklyn, New York, USA. August 3–6, 2008. pp. 209-221. ASME. https://doi.org/10.1115/DETC2008-49598
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