The design process of top-down collaborative assembly design is high parallel. There are complex task relationships not only in a task group but also among different task groups, which we call them as inside and outside relationships. A dynamic model of process planning based on hierarchical object-oriented Petri-net (HOOPN) is constructed for top-down collaborative assembly design. The dynamic model represents the outside and inside task relationships including parallel, sequential and coupling relationships. Based on the dynamic model, the dynamic supervising, analysis and decision-making for the states of the design process are implemented. The fuzzy overall evaluation model (FOEM) is utilized for risk evaluation of the design process. The task execution is influenced by local and global risk level from FOEM. Finally, the whole process planning is adjusted and controlled dynamically by the special risk decision-making mechanism.
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ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 3–6, 2008
Brooklyn, New York, USA
Conference Sponsors:
- Design Engineering Division and Computers in Engineering Division
ISBN:
978-0-7918-4327-7
PROCEEDINGS PAPER
Dynamic Model of Process Planning for Top-Down Collaborative Assembly Design Available to Purchase
Youdong Yang,
Youdong Yang
Zhejiang University, Hangzhou, China
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Shuting Zhang,
Shuting Zhang
Zhejiang University, Hangzhou, China
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Zhihua Li
Zhihua Li
Zhejiang University, Hangzhou, China
Search for other works by this author on:
Youdong Yang
Zhejiang University, Hangzhou, China
Shuting Zhang
Zhejiang University, Hangzhou, China
Zhihua Li
Zhejiang University, Hangzhou, China
Paper No:
DETC2008-49170, pp. 1217-1225; 9 pages
Published Online:
July 13, 2009
Citation
Yang, Y, Zhang, S, & Li, Z. "Dynamic Model of Process Planning for Top-Down Collaborative Assembly Design." Proceedings of the ASME 2008 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3: 28th Computers and Information in Engineering Conference, Parts A and B. Brooklyn, New York, USA. August 3–6, 2008. pp. 1217-1225. ASME. https://doi.org/10.1115/DETC2008-49170
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