Polystyrene (PS)-Organically modified montmorillonite (OMMT) nanocomposites processed by injection molding were investigated for the effects of different OMMT concentration and melt-blending conditions using a KrF excimer laser operating at 248 nm wavelength. Results indicate that PS-OMMT nanocomposites show improved resistance to excimer laser irradiation, as revealed by reduced mass loss due to laser ablation at their surfaces, when the OMMT concentration is below 2 wt%. Further increases in OMMT wt%, above the 2 wt% value, resulted in increased mass loss due to laser ablation, when compared with ablation of the neat PS material. Our experimental results also revealed that the dispersion (exfoliation) state of OMMT plays an important role in excimer laser ablation behavior of PS-OMMT nanocomposites. This result indicates the possibility for using the excimer laser as an evaluation tool in assessing the degree of exfoliation in clay reinforced polymer nanocomposites, including the assessment of spatial distribution of clay particles in injection molded nanocomposite articles, as illustrated in this work.
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ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
September 4–7, 2007
Las Vegas, Nevada, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
0-7918-4805-1
PROCEEDINGS PAPER
Evaluation of Processing Effects on Polystyrene/Clay Nanocomposites Using an Excimer Laser
Erol Sancaktar
Erol Sancaktar
University of Akron, Akron, OH
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I-Ta Chang
University of Akron, Akron, OH
Erol Sancaktar
University of Akron, Akron, OH
Paper No:
DETC2007-34406, pp. 423-427; 5 pages
Published Online:
May 20, 2009
Citation
Chang, I, & Sancaktar, E. "Evaluation of Processing Effects on Polystyrene/Clay Nanocomposites Using an Excimer Laser." Proceedings of the ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 4: ASME/IEEE International Conference on Mechatronic and Embedded Systems and Applications and the 19th Reliability, Stress Analysis, and Failure Prevention Conference. Las Vegas, Nevada, USA. September 4–7, 2007. pp. 423-427. ASME. https://doi.org/10.1115/DETC2007-34406
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