Microcantilever with embedded piezoresistor has been applied to in-situ surface stress measurement of biochemical reaction, where parallel microcantilever design by using an active cantilever for biosensing and another reference cantilever for noise cancellation has previously been proposed. This paper shows that the measurement is sensitive to the temperature effect induced by the piezoresistor. The temperature difference between the two cantilevers can reach 40°C at 10V operation because of their difference thermal capacitance. For the microcantilever of 125×65×0.75 μm, the offset voltage of the parallel microcantilever is 1.65 mV and the temperature drift is 0.01 mV/°C. An improved parallel microcantilever design is developed using the stripe pattern design on the immobilized layer and the signal conditioning circuit for temperature compensation in biosensors. Analyses and experiments show that the performance of a CMOS sensor chip can be significantly improved.
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ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
September 4–7, 2007
Las Vegas, Nevada, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
0-7918-4804-3
PROCEEDINGS PAPER
On the Temperature Compensation of Parallel Piezoresistive Microcantilevers in Biosensors
S. M. Yang
,
S. M. Yang
National Cheng Kung University, Taiwan, R.O.C.
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C. Chang
,
C. Chang
National Cheng Kung University, Taiwan, R.O.C.
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T. I. Yin
T. I. Yin
National Cheng Kung University, Taiwan, R.O.C.
Search for other works by this author on:
S. M. Yang
National Cheng Kung University, Taiwan, R.O.C.
C. Chang
National Cheng Kung University, Taiwan, R.O.C.
T. I. Yin
National Cheng Kung University, Taiwan, R.O.C.
Paper No:
DETC2007-34454, pp. 693-717; 25 pages
Published Online:
May 20, 2009
Citation
Yang, SM, Chang, C, & Yin, TI. "On the Temperature Compensation of Parallel Piezoresistive Microcantilevers in Biosensors." Proceedings of the ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3: 19th International Conference on Design Theory and Methodology; 1st International Conference on Micro- and Nanosystems; and 9th International Conference on Advanced Vehicle Tire Technologies, Parts A and B. Las Vegas, Nevada, USA. September 4–7, 2007. pp. 693-717. ASME. https://doi.org/10.1115/DETC2007-34454
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