Miniaturization, high reliability and low manufacturing costs require close spatial integration of mechanics and electronics. New production technologies such as MID (Molded Interconnect Device), which enables to manufacture three-dimensional circuit carriers and replace conventional PCBs, open up interesting perspectives in this context. These production technologies cause strong interdependencies between product design and manufacturing; they usually determine the product concept. These interdependencies are often not known to the designers. The design of systems with technologies like MID thus needs a design-supporting knowledge base to overcome this lack of information. This paper describes a knowledge base for the design of three-dimensional electronic circuit carriers in MID. The knowledge base provides the developer with adapted procedural models for the specific design task, which show the mentioned interdependencies, as well as appropriate guidelines and standards during the different design phases. Thus the necessary information is available to the designer at all times. The application of the knowledge base is shown by the example of the housing of an autonomous miniature robot. The miniature robot is manufactured in large numbers. It serves as a test bed for swarm intelligence and multi-agents applications in computer science as well as for the employment of the Technology MID.
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ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
September 4–7, 2007
Las Vegas, Nevada, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
0-7918-4803-5
PROCEEDINGS PAPER
Knowledge Based Design of 3D Electronic Circuit Carriers Available to Purchase
Ingo A. Kaiser,
Ingo A. Kaiser
University of Paderborn, Paderborn, Germany
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Ursula Frank,
Ursula Frank
University of Paderborn, Paderborn, Germany
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Juergen Gausemeier
Juergen Gausemeier
University of Paderborn, Paderborn, Germany
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Ingo A. Kaiser
University of Paderborn, Paderborn, Germany
Ursula Frank
University of Paderborn, Paderborn, Germany
Juergen Gausemeier
University of Paderborn, Paderborn, Germany
Paper No:
DETC2007-34663, pp. 957-964; 8 pages
Published Online:
May 20, 2009
Citation
Kaiser, IA, Frank, U, & Gausemeier, J. "Knowledge Based Design of 3D Electronic Circuit Carriers." Proceedings of the ASME 2007 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 2: 27th Computers and Information in Engineering Conference, Parts A and B. Las Vegas, Nevada, USA. September 4–7, 2007. pp. 957-964. ASME. https://doi.org/10.1115/DETC2007-34663
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