In the manufacturing of printed wiring boards (PWBs), various methods have been developed in order to improve the circuit packaging density. Micro-drills are generally used to make smaller diameter through-holes in PWBs, which are desired for the miniaturization of equipment. However, a problem has emerged in that copper plating degraded by hole drilling can reduce the reliability of the electrical connection between layers. The surface roughness of drilled hole wall is one of the important factors affecting the plating quality. The purpose of the present report is to apply data-mining to the surface roughness data of drilled through-hole walls, and to elucidate the factors required to control the drilled hole quality. The following conclusions were obtained. (1) The data-mining aided by a computer was found to be effective to control the drilled hole wall quality in the PWBs manufacturing. (2) It was clear that the surface roughness of drilled hole walls depended on three factors: the drill temperature, cutting distance, and the width of the fiber bundle of weft yarn.

This content is only available via PDF.
You do not currently have access to this content.