Conductive adhesives are widely used in electronic packaging applications such as die attachment and solderless interconnections, component repair, display interconnections, and heat dissipation. This research intends to provide an understanding of the effects of film thickness as functions of filler volume fraction, conductive filler size, shape, as well as uncured base adhesive viscosity on the electrical conduction behavior of such adhesives. Epoxy-based adhesives were filled with particles of different size, shape, and types, including Ni powder, flakes, and filaments, Ag powder, and Cu powder. The filaments were 20 µm in diameter, and 160 or 260 µm in length. Acid solutions including HCL, H3PO4, and HF were used to etch and remove the surface oxide layers. The plane resistance of filled adhesive films was measured using the four-point method. In general, the addition of micron-sized metal fillers to the conductive mixture resulted in distinct thickness thresholds for transition from three-dimensional conductivity to one-dimensional conductivity with considerable increases in plane resistivity when the film thicknesses were smaller than these threshold values. The relationships between the conductive film resistivities and the filler volume fractions were derived mathematically, based on the experimental data. The effects of surface treatment of filler particles, the type, size, shape of fillers, and the uncured epoxy viscosity were also included in this formulation.
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ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
September 2–6, 2003
Chicago, Illinois, USA
Conference Sponsors:
- Design Engineering Division and Computers and Information in Engineering Division
ISBN:
0-7918-3701-7
PROCEEDINGS PAPER
The Effects of Filler Volume Fraction and Film Thickness on Resistivity of Conductive Adhesives Available to Purchase
Erol Sancaktar,
Erol Sancaktar
University of Akron, Akron, OH
Search for other works by this author on:
Lan Bai
Lan Bai
University of Akron, Akron, OH
Search for other works by this author on:
Erol Sancaktar
University of Akron, Akron, OH
Lan Bai
University of Akron, Akron, OH
Paper No:
DETC2003/RSAFP-48694, pp. 957-974; 18 pages
Published Online:
June 23, 2008
Citation
Sancaktar, E, & Bai, L. "The Effects of Filler Volume Fraction and Film Thickness on Resistivity of Conductive Adhesives." Proceedings of the ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference. Volume 3c: 17th Reliability, Stress Analysis and Failure Prevention Conference. Chicago, Illinois, USA. September 2–6, 2003. pp. 957-974. ASME. https://doi.org/10.1115/DETC2003/RSAFP-48694
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