With the miniaturization of electronic products, reducing the size of the printed circuit board that forms the backbone of the product is paramount. Embedding passive components, which otherwise occupy valuable “real estate” atop the printed circuit board, into the printed circuit board substrate itself is one way of achieving this objective. This first part of this paper examines the techniques and advantages of embedding passives. Embedding passives also affects manufacturing system performance, due to a change in the processing sequence and changes to the processing times at resources. The latter portion of this paper describes a design for production tool for understanding the impact of embedding passives on the performance of a manufacturing system.

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