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Proceedings Papers

Proceedings Volume Cover
ASME 2022 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
August 14–17, 2022
St. Louis, Missouri, USA
Conference Sponsors:
  • Design Engineering Division
  • Computers and Information in Engineering Division
ISBN:
978-0-7918-8621-2
Volume 2: 42nd Computers and Information in Engineering Conference (CIE)

Front Matter

IDETC-CIE 2022; V002T00A001https://doi.org/10.1115/DETC2022-FM2

42nd Computers and Information in Engineering Conference (CIE)

AMS-CAPPD-SEIKM: Artificial Intelligence and Machine Learning in Design and Manufacturing

IDETC-CIE 2022; V002T02A001https://doi.org/10.1115/DETC2022-89073
IDETC-CIE 2022; V002T02A002https://doi.org/10.1115/DETC2022-89307
IDETC-CIE 2022; V002T02A003https://doi.org/10.1115/DETC2022-89452
IDETC-CIE 2022; V002T02A004https://doi.org/10.1115/DETC2022-89810
IDETC-CIE 2022; V002T02A005https://doi.org/10.1115/DETC2022-90084
IDETC-CIE 2022; V002T02A006https://doi.org/10.1115/DETC2022-90105
IDETC-CIE 2022; V002T02A007https://doi.org/10.1115/DETC2022-90108
IDETC-CIE 2022; V002T02A008https://doi.org/10.1115/DETC2022-90688
IDETC-CIE 2022; V002T02A009https://doi.org/10.1115/DETC2022-90934
IDETC-CIE 2022; V002T02A010https://doi.org/10.1115/DETC2022-91115
IDETC-CIE 2022; V002T02A011https://doi.org/10.1115/DETC2022-91219

AMS-CAPPD-SEIKM: Design, Simulation, and Optimization for Additive Manufacturing

IDETC-CIE 2022; V002T02A012https://doi.org/10.1115/DETC2022-89030
IDETC-CIE 2022; V002T02A013https://doi.org/10.1115/DETC2022-89300
IDETC-CIE 2022; V002T02A014https://doi.org/10.1115/DETC2022-89552
IDETC-CIE 2022; V002T02A015https://doi.org/10.1115/DETC2022-89819
IDETC-CIE 2022; V002T02A016https://doi.org/10.1115/DETC2022-89934
IDETC-CIE 2022; V002T02A017https://doi.org/10.1115/DETC2022-90673
IDETC-CIE 2022; V002T02A018https://doi.org/10.1115/DETC2022-90992
IDETC-CIE 2022; V002T02A019https://doi.org/10.1115/DETC2022-91021
IDETC-CIE 2022; V002T02A020https://doi.org/10.1115/DETC2022-91106

AMS-CAPPD: Digital Twin: Advanced Human Modeling and Simulation in Engineering

IDETC-CIE 2022; V002T02A021https://doi.org/10.1115/DETC2022-88968
IDETC-CIE 2022; V002T02A022https://doi.org/10.1115/DETC2022-89127
IDETC-CIE 2022; V002T02A023https://doi.org/10.1115/DETC2022-89187
IDETC-CIE 2022; V002T02A024https://doi.org/10.1115/DETC2022-89531
IDETC-CIE 2022; V002T02A025https://doi.org/10.1115/DETC2022-89752
IDETC-CIE 2022; V002T02A026https://doi.org/10.1115/DETC2022-89952

AMS: Advanced Modeling and Simulation (AMS General)

IDETC-CIE 2022; V002T02A027https://doi.org/10.1115/DETC2022-88146
IDETC-CIE 2022; V002T02A028https://doi.org/10.1115/DETC2022-88722
IDETC-CIE 2022; V002T02A029https://doi.org/10.1115/DETC2022-89562

AMS: Computational Multiphysics Applications

IDETC-CIE 2022; V002T02A030https://doi.org/10.1115/DETC2022-87995
IDETC-CIE 2022; V002T02A031https://doi.org/10.1115/DETC2022-89513
IDETC-CIE 2022; V002T02A032https://doi.org/10.1115/DETC2022-90996
IDETC-CIE 2022; V002T02A033https://doi.org/10.1115/DETC2022-91096

AMS: Inverse Problems in Science and Engineering

IDETC-CIE 2022; V002T02A034https://doi.org/10.1115/DETC2022-89514

AMS: Material Characterization Methods and Applications

IDETC-CIE 2022; V002T02A035https://doi.org/10.1115/DETC2022-91129

AMS: Simulation in Advanced Manufacturing

IDETC-CIE 2022; V002T02A036https://doi.org/10.1115/DETC2022-89833
IDETC-CIE 2022; V002T02A037https://doi.org/10.1115/DETC2022-91132

AMS: Uncertainty Quantification in Simulation and Model Verification and Validation

IDETC-CIE 2022; V002T02A038https://doi.org/10.1115/DETC2022-89213
IDETC-CIE 2022; V002T02A039https://doi.org/10.1115/DETC2022-89357
IDETC-CIE 2022; V002T02A040https://doi.org/10.1115/DETC2022-90027

CAPPD: Computational Fabrication for Product Design and Development

IDETC-CIE 2022; V002T02A041https://doi.org/10.1115/DETC2022-89538
IDETC-CIE 2022; V002T02A042https://doi.org/10.1115/DETC2022-89921

CAPPD: Computer-Aided Product and Process Development (CAPPD General)

IDETC-CIE 2022; V002T02A043https://doi.org/10.1115/DETC2022-87433
IDETC-CIE 2022; V002T02A044https://doi.org/10.1115/DETC2022-89145
IDETC-CIE 2022; V002T02A045https://doi.org/10.1115/DETC2022-89868
IDETC-CIE 2022; V002T02A046https://doi.org/10.1115/DETC2022-89940
IDETC-CIE 2022; V002T02A047https://doi.org/10.1115/DETC2022-90235
IDETC-CIE 2022; V002T02A048https://doi.org/10.1115/DETC2022-91214

CAPPD: Digital Human Modelling for Design and Manufacturing

IDETC-CIE 2022; V002T02A049https://doi.org/10.1115/DETC2022-89781
IDETC-CIE 2022; V002T02A050https://doi.org/10.1115/DETC2022-89974
IDETC-CIE 2022; V002T02A051https://doi.org/10.1115/DETC2022-90073

CAPPD: Human-in-the Loop Product Design and Automation

IDETC-CIE 2022; V002T02A052https://doi.org/10.1115/DETC2022-89556
IDETC-CIE 2022; V002T02A053https://doi.org/10.1115/DETC2022-90176
IDETC-CIE 2022; V002T02A054https://doi.org/10.1115/DETC2022-91173

CAPPD: Product and Process Design Automation for Industry 4.0

IDETC-CIE 2022; V002T02A055https://doi.org/10.1115/DETC2022-88786
IDETC-CIE 2022; V002T02A056https://doi.org/10.1115/DETC2022-88794
IDETC-CIE 2022; V002T02A057https://doi.org/10.1115/DETC2022-91300

SEIKM Special Session: Mission Engineering

IDETC-CIE 2022; V002T02A058https://doi.org/10.1115/DETC2022-90067

SEIKM: Design Informatics

IDETC-CIE 2022; V002T02A059https://doi.org/10.1115/DETC2022-89700
IDETC-CIE 2022; V002T02A060https://doi.org/10.1115/DETC2022-89711
IDETC-CIE 2022; V002T02A061https://doi.org/10.1115/DETC2022-89993
IDETC-CIE 2022; V002T02A062https://doi.org/10.1115/DETC2022-90465
IDETC-CIE 2022; V002T02A063https://doi.org/10.1115/DETC2022-90895
IDETC-CIE 2022; V002T02A064https://doi.org/10.1115/DETC2022-91086

SEIKM: Knowledge, Capture, Reuse, and Management

IDETC-CIE 2022; V002T02A065https://doi.org/10.1115/DETC2022-88206
IDETC-CIE 2022; V002T02A066https://doi.org/10.1115/DETC2022-89557
IDETC-CIE 2022; V002T02A067https://doi.org/10.1115/DETC2022-89657
IDETC-CIE 2022; V002T02A068https://doi.org/10.1115/DETC2022-90768
IDETC-CIE 2022; V002T02A069https://doi.org/10.1115/DETC2022-91145

SEIKM: Smart Manufacturing Informatics

IDETC-CIE 2022; V002T02A070https://doi.org/10.1115/DETC2022-88313
IDETC-CIE 2022; V002T02A071https://doi.org/10.1115/DETC2022-89172
IDETC-CIE 2022; V002T02A072https://doi.org/10.1115/DETC2022-89829
IDETC-CIE 2022; V002T02A073https://doi.org/10.1115/DETC2022-90919
IDETC-CIE 2022; V002T02A074https://doi.org/10.1115/DETC2022-91034
IDETC-CIE 2022; V002T02A075https://doi.org/10.1115/DETC2022-91218

SEIKM: Systems Engineering and Complex Systems

IDETC-CIE 2022; V002T02A076https://doi.org/10.1115/DETC2022-89939
IDETC-CIE 2022; V002T02A077https://doi.org/10.1115/DETC2022-90002
IDETC-CIE 2022; V002T02A078https://doi.org/10.1115/DETC2022-90305
IDETC-CIE 2022; V002T02A079https://doi.org/10.1115/DETC2022-90694
IDETC-CIE 2022; V002T02A080https://doi.org/10.1115/DETC2022-91080
IDETC-CIE 2022; V002T02A081https://doi.org/10.1115/DETC2022-91091

VES Video Presentation Exhibit: Visualization and Virtual Demonstration of Prototypes and Simulations

IDETC-CIE 2022; V002T02A082https://doi.org/10.1115/DETC2022-88223

VES: Technologies for VR, AR, and MR (Methods, Processes, and Applications)

IDETC-CIE 2022; V002T02A083https://doi.org/10.1115/DETC2022-88321
IDETC-CIE 2022; V002T02A084https://doi.org/10.1115/DETC2022-88605
IDETC-CIE 2022; V002T02A085https://doi.org/10.1115/DETC2022-89964
IDETC-CIE 2022; V002T02A086https://doi.org/10.1115/DETC2022-90553
IDETC-CIE 2022; V002T02A087https://doi.org/10.1115/DETC2022-90962
IDETC-CIE 2022; V002T02A088https://doi.org/10.1115/DETC2022-91023
IDETC-CIE 2022; V002T02A089https://doi.org/10.1115/DETC2022-91212
IDETC-CIE 2022; V002T02A090https://doi.org/10.1115/DETC2022-91254
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