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Proceedings Papers

ASME 2003 International Design Engineering Technical Conferences and Computers and Information in Engineering Conference
September 2–6, 2003
Chicago, Illinois, USA
Conference Sponsors:
  • Design Engineering Division and Computers and Information in Engineering Division
ISBN:
0-7918-3703-3
In This Volume
Volume 5: 19th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C

Mechanical Vibration and Noise

IDETC-CIE 2003; 89-104doi:https://doi.org/10.1115/DETC2003/VIB-48313
IDETC-CIE 2003; 105-113doi:https://doi.org/10.1115/DETC2003/VIB-48314
IDETC-CIE 2003; 115-121doi:https://doi.org/10.1115/DETC2003/VIB-48315
IDETC-CIE 2003; 123-132doi:https://doi.org/10.1115/DETC2003/VIB-48316
IDETC-CIE 2003; 133-142doi:https://doi.org/10.1115/DETC2003/VIB-48317
IDETC-CIE 2003; 143-152doi:https://doi.org/10.1115/DETC2003/VIB-48318
IDETC-CIE 2003; 153-161doi:https://doi.org/10.1115/DETC2003/VIB-48319
IDETC-CIE 2003; 163-169doi:https://doi.org/10.1115/DETC2003/VIB-48320
IDETC-CIE 2003; 171-181doi:https://doi.org/10.1115/DETC2003/VIB-48321
IDETC-CIE 2003; 183-191doi:https://doi.org/10.1115/DETC2003/VIB-48322
IDETC-CIE 2003; 193-202doi:https://doi.org/10.1115/DETC2003/VIB-48323
IDETC-CIE 2003; 203-208doi:https://doi.org/10.1115/DETC2003/VIB-48324
IDETC-CIE 2003; 209-218doi:https://doi.org/10.1115/DETC2003/VIB-48325
IDETC-CIE 2003; 219-230doi:https://doi.org/10.1115/DETC2003/VIB-48326
IDETC-CIE 2003; 231-240doi:https://doi.org/10.1115/DETC2003/VIB-48327
IDETC-CIE 2003; 241-250doi:https://doi.org/10.1115/DETC2003/VIB-48328
IDETC-CIE 2003; 251-258doi:https://doi.org/10.1115/DETC2003/VIB-48329
IDETC-CIE 2003; 259-265doi:https://doi.org/10.1115/DETC2003/VIB-48330
IDETC-CIE 2003; 267-275doi:https://doi.org/10.1115/DETC2003/VIB-48331
IDETC-CIE 2003; 277-286doi:https://doi.org/10.1115/DETC2003/VIB-48332
IDETC-CIE 2003; 287-293doi:https://doi.org/10.1115/DETC2003/VIB-48333
IDETC-CIE 2003; 295-302doi:https://doi.org/10.1115/DETC2003/VIB-48334
IDETC-CIE 2003; 303-308doi:https://doi.org/10.1115/DETC2003/VIB-48335
IDETC-CIE 2003; 309-315doi:https://doi.org/10.1115/DETC2003/VIB-48336
IDETC-CIE 2003; 317-321doi:https://doi.org/10.1115/DETC2003/VIB-48337
IDETC-CIE 2003; 323-329doi:https://doi.org/10.1115/DETC2003/VIB-48338
IDETC-CIE 2003; 331-340doi:https://doi.org/10.1115/DETC2003/VIB-48339
IDETC-CIE 2003; 341-350doi:https://doi.org/10.1115/DETC2003/VIB-48340
IDETC-CIE 2003; 351-360doi:https://doi.org/10.1115/DETC2003/VIB-48341
IDETC-CIE 2003; 361-370doi:https://doi.org/10.1115/DETC2003/VIB-48342
IDETC-CIE 2003; 371-378doi:https://doi.org/10.1115/DETC2003/VIB-48343
IDETC-CIE 2003; 379-388doi:https://doi.org/10.1115/DETC2003/VIB-48344
IDETC-CIE 2003; 389-398doi:https://doi.org/10.1115/DETC2003/VIB-48345
IDETC-CIE 2003; 399-408doi:https://doi.org/10.1115/DETC2003/VIB-48346
IDETC-CIE 2003; 409-416doi:https://doi.org/10.1115/DETC2003/VIB-48347
IDETC-CIE 2003; 417-424doi:https://doi.org/10.1115/DETC2003/VIB-48348
IDETC-CIE 2003; 425-430doi:https://doi.org/10.1115/DETC2003/VIB-48349
IDETC-CIE 2003; 431-438doi:https://doi.org/10.1115/DETC2003/VIB-48350
IDETC-CIE 2003; 439-447doi:https://doi.org/10.1115/DETC2003/VIB-48351
IDETC-CIE 2003; 449-455doi:https://doi.org/10.1115/DETC2003/VIB-48352
IDETC-CIE 2003; 457-466doi:https://doi.org/10.1115/DETC2003/VIB-48353
IDETC-CIE 2003; 467-476doi:https://doi.org/10.1115/DETC2003/VIB-48354
IDETC-CIE 2003; 477-484doi:https://doi.org/10.1115/DETC2003/VIB-48355
IDETC-CIE 2003; 485-493doi:https://doi.org/10.1115/DETC2003/VIB-48356
IDETC-CIE 2003; 495-503doi:https://doi.org/10.1115/DETC2003/VIB-48357
IDETC-CIE 2003; 505-518doi:https://doi.org/10.1115/DETC2003/VIB-48358
IDETC-CIE 2003; 519-527doi:https://doi.org/10.1115/DETC2003/VIB-48359
IDETC-CIE 2003; 529-538doi:https://doi.org/10.1115/DETC2003/VIB-48360
IDETC-CIE 2003; 539-547doi:https://doi.org/10.1115/DETC2003/VIB-48361
IDETC-CIE 2003; 549-555doi:https://doi.org/10.1115/DETC2003/VIB-48362
Topics: Resonance
IDETC-CIE 2003; 557-562doi:https://doi.org/10.1115/DETC2003/VIB-48363
IDETC-CIE 2003; 563-567doi:https://doi.org/10.1115/DETC2003/VIB-48364
IDETC-CIE 2003; 569-576doi:https://doi.org/10.1115/DETC2003/VIB-48365
IDETC-CIE 2003; 577-581doi:https://doi.org/10.1115/DETC2003/VIB-48366
IDETC-CIE 2003; 583-591doi:https://doi.org/10.1115/DETC2003/VIB-48367
IDETC-CIE 2003; 593-602doi:https://doi.org/10.1115/DETC2003/VIB-48368
IDETC-CIE 2003; 603-607doi:https://doi.org/10.1115/DETC2003/VIB-48369
IDETC-CIE 2003; 609-616doi:https://doi.org/10.1115/DETC2003/VIB-48370
IDETC-CIE 2003; 617-624doi:https://doi.org/10.1115/DETC2003/VIB-48371
IDETC-CIE 2003; 625-631doi:https://doi.org/10.1115/DETC2003/VIB-48372
IDETC-CIE 2003; 633-639doi:https://doi.org/10.1115/DETC2003/VIB-48373
IDETC-CIE 2003; 641-649doi:https://doi.org/10.1115/DETC2003/VIB-48374
IDETC-CIE 2003; 651-659doi:https://doi.org/10.1115/DETC2003/VIB-48375
IDETC-CIE 2003; 661-666doi:https://doi.org/10.1115/DETC2003/VIB-48376
IDETC-CIE 2003; 667-676doi:https://doi.org/10.1115/DETC2003/VIB-48377
IDETC-CIE 2003; 677-683doi:https://doi.org/10.1115/DETC2003/VIB-48380
Topics: Stability
IDETC-CIE 2003; 685-694doi:https://doi.org/10.1115/DETC2003/VIB-48381
IDETC-CIE 2003; 695-702doi:https://doi.org/10.1115/DETC2003/VIB-48382
IDETC-CIE 2003; 703-709doi:https://doi.org/10.1115/DETC2003/VIB-48383
IDETC-CIE 2003; 711-714doi:https://doi.org/10.1115/DETC2003/VIB-48384
IDETC-CIE 2003; 715-720doi:https://doi.org/10.1115/DETC2003/VIB-48385
Topics: Fractals
IDETC-CIE 2003; 721-727doi:https://doi.org/10.1115/DETC2003/VIB-48386
IDETC-CIE 2003; 729-735doi:https://doi.org/10.1115/DETC2003/VIB-48387
IDETC-CIE 2003; 737-743doi:https://doi.org/10.1115/DETC2003/VIB-48388
IDETC-CIE 2003; 745-752doi:https://doi.org/10.1115/DETC2003/VIB-48389
IDETC-CIE 2003; 753-760doi:https://doi.org/10.1115/DETC2003/VIB-48390
IDETC-CIE 2003; 761-769doi:https://doi.org/10.1115/DETC2003/VIB-48391
IDETC-CIE 2003; 771-780doi:https://doi.org/10.1115/DETC2003/VIB-48392
IDETC-CIE 2003; 781-787doi:https://doi.org/10.1115/DETC2003/VIB-48393
IDETC-CIE 2003; 789-798doi:https://doi.org/10.1115/DETC2003/VIB-48394
IDETC-CIE 2003; 799-807doi:https://doi.org/10.1115/DETC2003/VIB-48395
IDETC-CIE 2003; 809-818doi:https://doi.org/10.1115/DETC2003/VIB-48396
IDETC-CIE 2003; 819-828doi:https://doi.org/10.1115/DETC2003/VIB-48397
IDETC-CIE 2003; 829-832doi:https://doi.org/10.1115/DETC2003/VIB-48399
IDETC-CIE 2003; 833-842doi:https://doi.org/10.1115/DETC2003/VIB-48400
IDETC-CIE 2003; 843-848doi:https://doi.org/10.1115/DETC2003/VIB-48401
IDETC-CIE 2003; 849-857doi:https://doi.org/10.1115/DETC2003/VIB-48403
IDETC-CIE 2003; 859-866doi:https://doi.org/10.1115/DETC2003/VIB-48404
IDETC-CIE 2003; 867-876doi:https://doi.org/10.1115/DETC2003/VIB-48405
IDETC-CIE 2003; 877-884doi:https://doi.org/10.1115/DETC2003/VIB-48406
IDETC-CIE 2003; 885-893doi:https://doi.org/10.1115/DETC2003/VIB-48407
IDETC-CIE 2003; 895-901doi:https://doi.org/10.1115/DETC2003/VIB-48408
IDETC-CIE 2003; 903-912doi:https://doi.org/10.1115/DETC2003/VIB-48409
IDETC-CIE 2003; 913-921doi:https://doi.org/10.1115/DETC2003/VIB-48410
IDETC-CIE 2003; 923-930doi:https://doi.org/10.1115/DETC2003/VIB-48411
IDETC-CIE 2003; 931-937doi:https://doi.org/10.1115/DETC2003/VIB-48412
IDETC-CIE 2003; 939-946doi:https://doi.org/10.1115/DETC2003/VIB-48414
IDETC-CIE 2003; 947-954doi:https://doi.org/10.1115/DETC2003/VIB-48415
IDETC-CIE 2003; 955-959doi:https://doi.org/10.1115/DETC2003/VIB-48416
IDETC-CIE 2003; 961-967doi:https://doi.org/10.1115/DETC2003/VIB-48417
IDETC-CIE 2003; 969-974doi:https://doi.org/10.1115/DETC2003/VIB-48418
IDETC-CIE 2003; 975-980doi:https://doi.org/10.1115/DETC2003/VIB-48419
IDETC-CIE 2003; 981-987doi:https://doi.org/10.1115/DETC2003/VIB-48420
IDETC-CIE 2003; 989-998doi:https://doi.org/10.1115/DETC2003/VIB-48421
IDETC-CIE 2003; 999-1001doi:https://doi.org/10.1115/DETC2003/VIB-48422
IDETC-CIE 2003; 1003-1010doi:https://doi.org/10.1115/DETC2003/VIB-48423
IDETC-CIE 2003; 1011-1020doi:https://doi.org/10.1115/DETC2003/VIB-48424
IDETC-CIE 2003; 1021-1030doi:https://doi.org/10.1115/DETC2003/VIB-48425
IDETC-CIE 2003; 1031-1040doi:https://doi.org/10.1115/DETC2003/VIB-48426
IDETC-CIE 2003; 1041-1046doi:https://doi.org/10.1115/DETC2003/VIB-48427
IDETC-CIE 2003; 1047-1054doi:https://doi.org/10.1115/DETC2003/VIB-48428
IDETC-CIE 2003; 1055-1059doi:https://doi.org/10.1115/DETC2003/VIB-48430
IDETC-CIE 2003; 1061-1070doi:https://doi.org/10.1115/DETC2003/VIB-48431
IDETC-CIE 2003; 1071-1080doi:https://doi.org/10.1115/DETC2003/VIB-48432
IDETC-CIE 2003; 1081-1089doi:https://doi.org/10.1115/DETC2003/VIB-48433
IDETC-CIE 2003; 1091-1100doi:https://doi.org/10.1115/DETC2003/VIB-48434
IDETC-CIE 2003; 1101-1108doi:https://doi.org/10.1115/DETC2003/VIB-48435
IDETC-CIE 2003; 1109-1116doi:https://doi.org/10.1115/DETC2003/VIB-48436
IDETC-CIE 2003; 1117-1124doi:https://doi.org/10.1115/DETC2003/VIB-48437
IDETC-CIE 2003; 1125-1133doi:https://doi.org/10.1115/DETC2003/VIB-48438
IDETC-CIE 2003; 1135-1143doi:https://doi.org/10.1115/DETC2003/VIB-48439
IDETC-CIE 2003; 1145-1154doi:https://doi.org/10.1115/DETC2003/VIB-48440
IDETC-CIE 2003; 1155-1165doi:https://doi.org/10.1115/DETC2003/VIB-48441
IDETC-CIE 2003; 1167-1176doi:https://doi.org/10.1115/DETC2003/VIB-48442
IDETC-CIE 2003; 1177-1188doi:https://doi.org/10.1115/DETC2003/VIB-48443
IDETC-CIE 2003; 1189-1196doi:https://doi.org/10.1115/DETC2003/VIB-48444
IDETC-CIE 2003; 1197-1207doi:https://doi.org/10.1115/DETC2003/VIB-48445
IDETC-CIE 2003; 1209-1220doi:https://doi.org/10.1115/DETC2003/VIB-48446
IDETC-CIE 2003; 1221-1230doi:https://doi.org/10.1115/DETC2003/VIB-48447
IDETC-CIE 2003; 1231-1240doi:https://doi.org/10.1115/DETC2003/VIB-48448
IDETC-CIE 2003; 1241-1250doi:https://doi.org/10.1115/DETC2003/VIB-48449
IDETC-CIE 2003; 1251-1258doi:https://doi.org/10.1115/DETC2003/VIB-48450
IDETC-CIE 2003; 1259-1262doi:https://doi.org/10.1115/DETC2003/VIB-48451
IDETC-CIE 2003; 1263-1270doi:https://doi.org/10.1115/DETC2003/VIB-48452
IDETC-CIE 2003; 1271-1280doi:https://doi.org/10.1115/DETC2003/VIB-48453
IDETC-CIE 2003; 1281-1288doi:https://doi.org/10.1115/DETC2003/VIB-48454
IDETC-CIE 2003; 1289-1296doi:https://doi.org/10.1115/DETC2003/VIB-48455
IDETC-CIE 2003; 1297-1304doi:https://doi.org/10.1115/DETC2003/VIB-48456
IDETC-CIE 2003; 1305-1317doi:https://doi.org/10.1115/DETC2003/VIB-48457
IDETC-CIE 2003; 1319-1326doi:https://doi.org/10.1115/DETC2003/VIB-48458
IDETC-CIE 2003; 1327-1336doi:https://doi.org/10.1115/DETC2003/VIB-48459
IDETC-CIE 2003; 1337-1345doi:https://doi.org/10.1115/DETC2003/VIB-48460
IDETC-CIE 2003; 1347-1356doi:https://doi.org/10.1115/DETC2003/VIB-48462
IDETC-CIE 2003; 1357-1365doi:https://doi.org/10.1115/DETC2003/VIB-48463
IDETC-CIE 2003; 1367-1375doi:https://doi.org/10.1115/DETC2003/VIB-48464
IDETC-CIE 2003; 1377-1385doi:https://doi.org/10.1115/DETC2003/VIB-48465
IDETC-CIE 2003; 1387-1396doi:https://doi.org/10.1115/DETC2003/VIB-48466
IDETC-CIE 2003; 1397-1406doi:https://doi.org/10.1115/DETC2003/VIB-48467
IDETC-CIE 2003; 1407-1416doi:https://doi.org/10.1115/DETC2003/VIB-48468
IDETC-CIE 2003; 1417-1421doi:https://doi.org/10.1115/DETC2003/VIB-48469
IDETC-CIE 2003; 1423-1431doi:https://doi.org/10.1115/DETC2003/VIB-48470
IDETC-CIE 2003; 1433-1438doi:https://doi.org/10.1115/DETC2003/VIB-48471
IDETC-CIE 2003; 1439-1443doi:https://doi.org/10.1115/DETC2003/VIB-48472
IDETC-CIE 2003; 1445-1447doi:https://doi.org/10.1115/DETC2003/VIB-48473
IDETC-CIE 2003; 1449-1457doi:https://doi.org/10.1115/DETC2003/VIB-48474
IDETC-CIE 2003; 1459-1464doi:https://doi.org/10.1115/DETC2003/VIB-48475
IDETC-CIE 2003; 1465-1472doi:https://doi.org/10.1115/DETC2003/VIB-48476
IDETC-CIE 2003; 1473-1477doi:https://doi.org/10.1115/DETC2003/VIB-48477
IDETC-CIE 2003; 1479-1490doi:https://doi.org/10.1115/DETC2003/VIB-48478
IDETC-CIE 2003; 1491-1497doi:https://doi.org/10.1115/DETC2003/VIB-48479
IDETC-CIE 2003; 1499-1507doi:https://doi.org/10.1115/DETC2003/VIB-48480
IDETC-CIE 2003; 1509-1516doi:https://doi.org/10.1115/DETC2003/VIB-48481
IDETC-CIE 2003; 1517-1522doi:https://doi.org/10.1115/DETC2003/VIB-48482
IDETC-CIE 2003; 1523-1528doi:https://doi.org/10.1115/DETC2003/VIB-48483
IDETC-CIE 2003; 1529-1535doi:https://doi.org/10.1115/DETC2003/VIB-48484
IDETC-CIE 2003; 1537-1546doi:https://doi.org/10.1115/DETC2003/VIB-48485
IDETC-CIE 2003; 1547-1554doi:https://doi.org/10.1115/DETC2003/VIB-48486
IDETC-CIE 2003; 1555-1558doi:https://doi.org/10.1115/DETC2003/VIB-48487
IDETC-CIE 2003; 1559-1568doi:https://doi.org/10.1115/DETC2003/VIB-48488
IDETC-CIE 2003; 1569-1574doi:https://doi.org/10.1115/DETC2003/VIB-48490
IDETC-CIE 2003; 1575-1578doi:https://doi.org/10.1115/DETC2003/VIB-48491
IDETC-CIE 2003; 1579-1584doi:https://doi.org/10.1115/DETC2003/VIB-48492
IDETC-CIE 2003; 1585-1592doi:https://doi.org/10.1115/DETC2003/VIB-48493
IDETC-CIE 2003; 1593-1600doi:https://doi.org/10.1115/DETC2003/VIB-48494
IDETC-CIE 2003; 1601-1610doi:https://doi.org/10.1115/DETC2003/VIB-48495
IDETC-CIE 2003; 1611-1614doi:https://doi.org/10.1115/DETC2003/VIB-48496
IDETC-CIE 2003; 1615-1619doi:https://doi.org/10.1115/DETC2003/VIB-48497
IDETC-CIE 2003; 1621-1624doi:https://doi.org/10.1115/DETC2003/VIB-48498
IDETC-CIE 2003; 1625-1632doi:https://doi.org/10.1115/DETC2003/VIB-48500
IDETC-CIE 2003; 1633-1642doi:https://doi.org/10.1115/DETC2003/VIB-48501
IDETC-CIE 2003; 1643-1651doi:https://doi.org/10.1115/DETC2003/VIB-48502
IDETC-CIE 2003; 1653-1661doi:https://doi.org/10.1115/DETC2003/VIB-48503
IDETC-CIE 2003; 1663-1670doi:https://doi.org/10.1115/DETC2003/VIB-48504
IDETC-CIE 2003; 1671-1676doi:https://doi.org/10.1115/DETC2003/VIB-48505
IDETC-CIE 2003; 1677-1685doi:https://doi.org/10.1115/DETC2003/VIB-48506
IDETC-CIE 2003; 1687-1695doi:https://doi.org/10.1115/DETC2003/VIB-48507
IDETC-CIE 2003; 1697-1704doi:https://doi.org/10.1115/DETC2003/VIB-48508
IDETC-CIE 2003; 1705-1713doi:https://doi.org/10.1115/DETC2003/VIB-48509
IDETC-CIE 2003; 1715-1724doi:https://doi.org/10.1115/DETC2003/VIB-48510
IDETC-CIE 2003; 1725-1731doi:https://doi.org/10.1115/DETC2003/VIB-48511
IDETC-CIE 2003; 1733-1738doi:https://doi.org/10.1115/DETC2003/VIB-48512
Topics: Sensors
IDETC-CIE 2003; 1739-1748doi:https://doi.org/10.1115/DETC2003/VIB-48514
IDETC-CIE 2003; 1749-1758doi:https://doi.org/10.1115/DETC2003/VIB-48515
IDETC-CIE 2003; 1759-1769doi:https://doi.org/10.1115/DETC2003/VIB-48516
IDETC-CIE 2003; 1771-1778doi:https://doi.org/10.1115/DETC2003/VIB-48517
IDETC-CIE 2003; 1779-1787doi:https://doi.org/10.1115/DETC2003/VIB-48518
IDETC-CIE 2003; 1789-1794doi:https://doi.org/10.1115/DETC2003/VIB-48519
IDETC-CIE 2003; 1795-1800doi:https://doi.org/10.1115/DETC2003/VIB-48520
IDETC-CIE 2003; 1801-1805doi:https://doi.org/10.1115/DETC2003/VIB-48521
IDETC-CIE 2003; 1807-1814doi:https://doi.org/10.1115/DETC2003/VIB-48522
IDETC-CIE 2003; 1815-1819doi:https://doi.org/10.1115/DETC2003/VIB-48523
IDETC-CIE 2003; 1821-1830doi:https://doi.org/10.1115/DETC2003/VIB-48524
IDETC-CIE 2003; 1831-1836doi:https://doi.org/10.1115/DETC2003/VIB-48525
IDETC-CIE 2003; 1837-1842doi:https://doi.org/10.1115/DETC2003/VIB-48526
IDETC-CIE 2003; 1843-1849doi:https://doi.org/10.1115/DETC2003/VIB-48527
IDETC-CIE 2003; 1851-1856doi:https://doi.org/10.1115/DETC2003/VIB-48528
IDETC-CIE 2003; 1857-1865doi:https://doi.org/10.1115/DETC2003/VIB-48529
IDETC-CIE 2003; 1867-1874doi:https://doi.org/10.1115/DETC2003/VIB-48530
IDETC-CIE 2003; 1875-1882doi:https://doi.org/10.1115/DETC2003/VIB-48531
IDETC-CIE 2003; 1883-1888doi:https://doi.org/10.1115/DETC2003/VIB-48532
IDETC-CIE 2003; 1889-1895doi:https://doi.org/10.1115/DETC2003/VIB-48533
IDETC-CIE 2003; 1897-1905doi:https://doi.org/10.1115/DETC2003/VIB-48534
IDETC-CIE 2003; 1907-1915doi:https://doi.org/10.1115/DETC2003/VIB-48535
IDETC-CIE 2003; 1917-1924doi:https://doi.org/10.1115/DETC2003/VIB-48536
IDETC-CIE 2003; 1925-1935doi:https://doi.org/10.1115/DETC2003/VIB-48537
IDETC-CIE 2003; 1937-1945doi:https://doi.org/10.1115/DETC2003/VIB-48538
IDETC-CIE 2003; 1947-1954doi:https://doi.org/10.1115/DETC2003/VIB-48539
IDETC-CIE 2003; 1955-1961doi:https://doi.org/10.1115/DETC2003/VIB-48540
IDETC-CIE 2003; 1963-1972doi:https://doi.org/10.1115/DETC2003/VIB-48541
IDETC-CIE 2003; 1973-1978doi:https://doi.org/10.1115/DETC2003/VIB-48542