The present study was intended to examine how the condensation heat transfer, especially the dropwise condensation, was affected by modifying the surface nature. In the present study, condensation heat transfer experiments for steam were performed by using mirror-finished copper surface and some very thin metal-film surfaces by using sputtering on mirror-finished copper block. That is, the effects on pattern of condensation heat transfer, i.e., dropwise or film-wise condensation, of metal-sputtered surfaces were examined experimentally and qualitatively. The present experimental results showed that the condensation on sputtered metal surfaces of Copper (Cu), Chromium (Cr) and Lead (Pb), became dropwise condensation. The heat transfer coefficients were ten times higher than the Nusselt equation. The condensation on sputtered metal surface of Titanium (Ti) became filmwise condensation. High contact angle was trended to be dropwise condensation on very thin metal-film surfaces by using sputtering.
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2013 21st International Conference on Nuclear Engineering
July 29–August 2, 2013
Chengdu, China
Conference Sponsors:
- Nuclear Engineering Division
ISBN:
978-0-7918-5583-6
PROCEEDINGS PAPER
Study on Condensation Heat Transfer on Micro Structured Surfaces (Effect on Condensation Heat Transfer of Metal Sputtering Surfaces) Available to Purchase
Kohei Yamazaki,
Kohei Yamazaki
Kogakuin University, Hachioji, Tokyo, Japan
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Hiroyasu Ohtake,
Hiroyasu Ohtake
Kogakuin University, Hachioji, Tokyo, Japan
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Koji Hasegawa
Koji Hasegawa
Kogakuin University, Hachioji, Tokyo, Japan
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Kohei Yamazaki
Kogakuin University, Hachioji, Tokyo, Japan
Hiroyasu Ohtake
Kogakuin University, Hachioji, Tokyo, Japan
Koji Hasegawa
Kogakuin University, Hachioji, Tokyo, Japan
Paper No:
ICONE21-16315, V006T16A034; 4 pages
Published Online:
February 7, 2014
Citation
Yamazaki, K, Ohtake, H, & Hasegawa, K. "Study on Condensation Heat Transfer on Micro Structured Surfaces (Effect on Condensation Heat Transfer of Metal Sputtering Surfaces)." Proceedings of the 2013 21st International Conference on Nuclear Engineering. Volume 6: Beyond Design Basis Events; Student Paper Competition. Chengdu, China. July 29–August 2, 2013. V006T16A034. ASME. https://doi.org/10.1115/ICONE21-16315
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