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Proceedings Papers

High Heat Flux Boiling Heat Transfer for Laser Diode Arrays

Todd M. Bandhauer, Taylor A. Bevis
Proc. ASME. ICNMM2016, ASME 2016 14th International Conference on Nanochannels, Microchannels, and Minichannels, V001T04A002, July 10–14, 2016
Paper No: ICNMM2016-7947
DOI: https://doi.org/10.1115/ICNMM2016-7947
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Topics: Boiling, Heat flux, Heat transfer, Lasers, Heat, Fluids, Cooling, Flow (Dynamics), Flux (Metallurgy), Heat transfer coefficients
Proceedings Papers

A Standard Method to Determine Loss Coefficients of Conduit Components Based on the Second Law of Thermodynamics

Bastian Schmandt, Heinz Herwig
Proc. ASME. ICNMM2012, ASME 2012 10th International Conference on Nanochannels, Microchannels, and Minichannels, 725-737, July 8–12, 2012
Paper No: ICNMM2012-73249
DOI: https://doi.org/10.1115/ICNMM2012-73249
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Topics: Computer simulation, Entropy, Flow (Dynamics), Fluids, Gear pumps, Laminar flow, Microelectromechanical systems, Pipes, Reynolds number, Second law of thermodynamics
Proceedings Papers

Mocrochannel Evaporators of the Residential Air-Conditioner

Honggi Cho, Keumnam Cho
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 625-630, June 18–20, 2007
Paper No: ICNMM2007-30032
DOI: https://doi.org/10.1115/ICNMM2007-30032
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Topics: Air conditioners, Cooling, Flow (Dynamics), Circuits, Heat exchangers, Manifolds, Microchannels, Pipes, Compression, Engineering prototypes
Proceedings Papers

Test Facilities for a Continuous Transition From Mini- to Microchannels

H. Herwig, O. Hausner
Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 753-757, April 24–25, 2003
Paper No: ICMM2003-1098
DOI: https://doi.org/10.1115/ICMM2003-1098
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Topics: Microchannels, Test facilities, Flow (Dynamics), Channel flow, Construction, Heat transfer, Microfabrication
Proceedings Papers

Design of a Test Facility and Micro-Channel Heat Exchanger Prototype for High Power Electronic Components

Ryan J. McGlen, Jon Lee, Cosimo Buffone
Proc. ASME. ICMM2005, ASME 3rd International Conference on Microchannels and Minichannels, Part B cont’d, 209-214, June 13–15, 2005
Paper No: ICMM2005-75068
DOI: https://doi.org/10.1115/ICMM2005-75068
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Topics: Design, Electronic components, Engineering prototypes, Heat exchangers, Microchannels, Test facilities, Convection, Cooling, Electronics, Heat flux