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Proceedings Papers

Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes

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Jensen Hoke, Todd Bandhauer, Jack Kotovsky, Julie Hamilton, Paul Fontejon
Proc. ASME. ICNMM2018, ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels, V001T11A003, June 10–13, 2018
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2018-7664
https://doi.org/10.1115/ICNMM2018-7664
View Paper titled, Heat Transfer Enhancement in Compact Phase Change Microchannel Heat Exchangers for High Flux Laser Diodes
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Topics: Heat exchangers, Heat transfer, Lasers, Microchannels, Heat, Flow (Dynamics), Flux (Metallurgy), Heat flux, Boiling, Borosilicate glasses
Proceedings Papers

Fabrication of Inverted Trapezoidal Microstructures for Heat Transfer and Microfluidics Applications

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Henry Ems, Sidy Ndao
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T08A001, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21071
https://doi.org/10.1115/ICNMM2014-21071
View Paper titled, Fabrication of Inverted Trapezoidal Microstructures for Heat Transfer and Microfluidics Applications
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Topics: Heat transfer, Manufacturing, Microfluidics, Semiconductor wafers, Silicon, Etching, Silicon-on-insulator, Bonding, Anisotropy, Chemical etching
Proceedings Papers

Pressure Drop Measurements in Turbulent Channel Flow Over Superhydrophobic Surfaces With Riblets

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Joseph F. Prince, Daniel Maynes, Julie Crockett
Proc. ASME. ICNMM2014, ASME 2014 12th International Conference on Nanochannels, Microchannels and Minichannels, V001T08A004, August 3–7, 2014
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2014-21690
https://doi.org/10.1115/ICNMM2014-21690
View Paper titled, Pressure Drop Measurements in Turbulent Channel Flow Over Superhydrophobic Surfaces With Riblets
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Topics: Channel flow, Pressure drop, Turbulence, Drag (Fluid dynamics), Semiconductor wafers, Cavities, Flow (Dynamics), Damping, Drag reduction, Friction
Proceedings Papers

Subcooled Flow Boiling Over Nanostructured Plate Integrated Into a Rectangular Channel

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Ebru Demir, Muhsincan Sesen, Turker Izci, Wisam Khudhayer, Tansel Karabacak, Ali Kosar
Proc. ASME. ICNMM2013, ASME 2013 11th International Conference on Nanochannels, Microchannels, and Minichannels, V001T09A007, June 16–19, 2013
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2013-73154
https://doi.org/10.1115/ICNMM2013-73154
View Paper titled, Subcooled Flow Boiling Over Nanostructured Plate Integrated Into a Rectangular Channel
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Topics: Boiling, Flow (Dynamics), Subcooling, Dimensions, Nanorods, Copper, Heat transfer, Cooling, Damage, Flux (Metallurgy)
Proceedings Papers

Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels

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Chungpyo Hong, Toru Yamada, Yutaka Asako, Mohammad Faghri, Ichiro Ueno
Proc. ASME. ICNMM2011, ASME 2011 9th International Conference on Nanochannels, Microchannels, and Minichannels, Volume 1, 327-334, June 19–22, 2011
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2011-58100
https://doi.org/10.1115/ICNMM2011-58100
View Paper titled, Experimental Investigations of Laminar, Transitional to Turbulent Gas Flow in Rib-Patterned Micro-Channels
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Topics: Gas flow, Microchannels, Turbulence, Friction, Flow (Dynamics), Mach number, Glass, Pressure, Reynolds number, Semiconductor wafers
Proceedings Papers

Compressible Microchannel Flow

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Gholamreza Mirshekari, Martin Brouillette
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 433-441, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-30399
https://doi.org/10.1115/FEDSM-ICNMM2010-30399
View Paper titled, Compressible Microchannel Flow
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Topics: Borosilicate glasses, Displacement, Etching, Flow (Dynamics), Friction, Gas flow, Glass, Mach number, Microchannel flow, Microchannels
Proceedings Papers

Characterization of Capillary Flow Within a Homogenously Dispersed Array of Vertical Micropillars

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Conan Zhang, Carlos H. Hidrovo
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 655-663, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-30526
https://doi.org/10.1115/FEDSM-ICNMM2010-30526
View Paper titled, Characterization of Capillary Flow Within a Homogenously Dispersed Array of Vertical Micropillars
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Topics: Flow (Dynamics), Fluid dynamics, Columns (Structural), Dimensions, Pumps, Fluidic devices, Geometry, Optimization, Reactive-ion etching, Semiconductor wafers
Proceedings Papers

Experimental Investigation of Dielectrophoretic Behavior of Myoglobin and Silica Particles on a Microelectrode Chip

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Naga Siva Kumar Gunda, Sushanta Kumar Mitra
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 1427-1433, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-30306
https://doi.org/10.1115/FEDSM-ICNMM2010-30306
View Paper titled, Experimental Investigation of Dielectrophoretic Behavior of Myoglobin and Silica Particles on a Microelectrode Chip
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Topics: Particulate matter, Dielectrophoresis, Electrokinetics, Etching, Glass, Metals, Microfabrication, Photolithography, Semiconductor wafers, Transparency
Proceedings Papers

Experimental Study of Microbubble Formation in Micro Channel

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T. J. John, H. Hegab
Proc. ASME. ICNMM2010, ASME 2010 8th International Conference on Nanochannels, Microchannels, and Minichannels: Parts A and B, 1763-1769, August 1–5, 2010
Publisher: American Society of Mechanical Engineers
Paper No: FEDSM-ICNMM2010-31155
https://doi.org/10.1115/FEDSM-ICNMM2010-31155
View Paper titled, Experimental Study of Microbubble Formation in Micro Channel
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Topics: Bubbles, Junctions, Microbubbles, Microchannels, Gas flow, Flow (Dynamics), Glass, Semiconductor wafers, Cross-flow, Dry etching
Proceedings Papers

Fabrication of Nanochannels on Polymer Thin Film

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Vinh-Nguyen Phan, Patrick Abgrall, Nam-Trung Nguyen, Peige Shao, Jeroen Anton Van Kan
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 921-925, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82057
https://doi.org/10.1115/ICNMM2009-82057
View Paper titled, Fabrication of Nanochannels on Polymer Thin Film
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Topics: Manufacturing, Polymers, Thin films, Bonding, Embossing, Atomic force microscopy, Pressure, Reactive-ion etching, Temperature, Dimensions
Proceedings Papers

Experimental Study on Behavior of Bubbles and Temperature Fluctuation of Heat Transfer Surface by Using Heat Transfer Surface With Artificial Cavities Created by MEMS Technology

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Takato Sato, Yasuo Koizumi, Hiroyasu Ohtake
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 105-111, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82276
https://doi.org/10.1115/ICNMM2009-82276
View Paper titled, Experimental Study on Behavior of Bubbles and Temperature Fluctuation of Heat Transfer Surface by Using Heat Transfer Surface With Artificial Cavities Created by MEMS Technology
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Topics: Bubbles, Cavities, Heat transfer, Microelectromechanical systems, Temperature, Resolution (Optics), Boiling, Mirrors, Nucleate boiling, Radiation (Physics)
Proceedings Papers

Ion Transport in 2-NM Nanochannels

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Chuanhua Duan, Arun Majumdar
Proc. ASME. ICNMM2009, ASME 2009 7th International Conference on Nanochannels, Microchannels and Minichannels, 943-948, June 22–24, 2009
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2009-82190
https://doi.org/10.1115/ICNMM2009-82190
View Paper titled, Ion Transport in 2-NM Nanochannels
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Topics: Bonding, Borosilicate glasses, Dry etching, Electrical conductance, Geometry, Grain boundary diffusion, Mechanical admittance, Protons, Semiconductor wafers, Simulation results
Proceedings Papers

A Systematic Approach to Wall Roughness Effects in Laminar Channel Flows: Experiments and Modelling

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D. Gloss, J. Dittmer, H. Herwig
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 39-46, June 23–25, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2008-62147
https://doi.org/10.1115/ICNMM2008-62147
View Paper titled, A Systematic Approach to Wall Roughness Effects in Laminar Channel Flows: Experiments and Modelling
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Topics: Channel flow, Modeling, Surface roughness, Computational fluid dynamics, Entropy, Air flow, Computer simulation, Disks, Error analysis, Flow (Dynamics)
Proceedings Papers

Micro Oscillation Heat Pipe Fabricated on Silicon Wafer

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Masamichi Kohno, Takashi Nishizono, Yasunori Onaka, Sumitomo Hidaka, Koji Takahashi, Yasuyuki Takata
Proc. ASME. ICNMM2008, ASME 2008 6th International Conference on Nanochannels, Microchannels, and Minichannels, 1343-1346, June 23–25, 2008
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2008-62082
https://doi.org/10.1115/ICNMM2008-62082
View Paper titled, Micro Oscillation Heat Pipe Fabricated on Silicon Wafer
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Topics: Heat pipes, Oscillations, Semiconductor wafers, Flow (Dynamics), Fluids, Heat, Heat transfer, Microchannels, Pulsatile flow, Vibration
Proceedings Papers

Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices

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Lauren Everhart, Nicholas Jankowski, Bruce Geil, Andrew Bayba, Dimeji Ibitayo, Patrick McCluskey
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 285-292, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30190
https://doi.org/10.1115/ICNMM2007-30190
View Paper titled, Manifold Microchannel Cooler for Direct Backside Liquid Cooling of SiC Power Devices
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Topics: Cooling, Manifolds, Microchannels, Design, Engineering simulation, Manufacturing, Pressure drop, Simulation, Flow (Dynamics), Heat
Proceedings Papers

Experimental Study of Flow Boiling in Microchannel

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S. G. Singh, S. P. Duttagupta, A. M. Kulkarni, B. P. Puranik, A. Agrawal
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 229-235, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30130
https://doi.org/10.1115/ICNMM2007-30130
View Paper titled, Experimental Study of Flow Boiling in Microchannel
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Topics: Boiling, Flow (Dynamics), Microchannels, Pressure drop, Two-phase flow, Heat, Heat flux, Heat transfer, Semiconductor wafers, Computer cooling
Proceedings Papers

Bulk Micromachining of High Index Silicon Wafers and Possible Applications in Microchannels and Diffractive Elements

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W. Calleja-Arriaga, C. Zu´n˜iga-Islas, P. Rosales-Quintero, J. De la Hidalga-Wade, C. Reyes-Betanzo, A. Torres-Jacome, M. Linares-Aranda
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 443-448, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30189
https://doi.org/10.1115/ICNMM2007-30189
View Paper titled, Bulk Micromachining of High Index Silicon Wafers and Possible Applications in Microchannels and Diffractive Elements
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Topics: Microchannels, Micromachining, Semiconductor wafers, Etching, Microfluidics, Diffraction gratings, Manufacturing, Microelectromechanical systems, Optics, Silicon
Proceedings Papers

Micro-Refrigerator Fabricated on Silicon Wafer

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Y. Takata, K. Sugahara, T. Tachikawa, S. Moroe, H. Kubota, M. Kohno, K. Takahashi, T. Koshimizu
Proc. ASME. ICNMM2007, ASME 5th International Conference on Nanochannels, Microchannels, and Minichannels, 749-753, June 18–20, 2007
Publisher: American Society of Mechanical Engineers
Paper No: ICNMM2007-30108
https://doi.org/10.1115/ICNMM2007-30108
View Paper titled, Micro-Refrigerator Fabricated on Silicon Wafer
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Topics: Semiconductor wafers, Heat exchangers, Flow (Dynamics), Cooling, Microcoolers, Temperature, Thermal conductivity, Engineering prototypes, Joules, Numerical analysis
Proceedings Papers

Gaseous Slip Flow in a Micro-Channel

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Shou-Shing Hsieh, Huang-Hsiu Tsai, Chih-Yi Lin, Ching-Fang Huang, Cheng-Ming Chien
Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 299-306, April 24–25, 2003
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2003-1033
https://doi.org/10.1115/ICMM2003-1033
View Paper titled, Gaseous Slip Flow in a Micro-Channel
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Topics: Microchannels, Slip flow, Flow (Dynamics), Boundary-value problems, Gas flow, Knudsen number, Nitrogen, Pressure drop, Reynolds number, Semiconductor wafers
Proceedings Papers

Fabrication Technologies for Advanced Heat Transfer Applications

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William J. Grande
Proc. ASME. ICMM2003, 1st International Conference on Microchannels and Minichannels, 215-222, April 24–25, 2003
Publisher: American Society of Mechanical Engineers
Paper No: ICMM2003-1023
https://doi.org/10.1115/ICMM2003-1023
View Paper titled, Fabrication Technologies for Advanced Heat Transfer Applications
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Topics: Heat transfer, Manufacturing, Microchannels, Machining, Bonding, Micromachining, Rapid prototyping, Semiconductor wafers