In the present experimental study, an attempt has been made to study the efficient thermal management system based on phase change material for cooling of portable electronic devices. Paraffin wax is used as PCM to keep the temperature of electronic devices below critical temperature by absorbing thermal energy released by electronic components. PCM is filled inside the heat sink made of aluminum. Four different configuration of heat sink such as unfinned heat sink filled with pure PCM, two finned heat sink filled with pure PCM, unfinned heat sink filled with MF-PCM composite and two finned heat sink filled with MF-PCM composite are used in the present investigation to enhance the operating time of heat sink to reach critical set point temperature. Unfinned heat sink filled with and without PCM is used for baseline comparison. Effect of volume fraction of PCM, effect of heat flux and enhancement in operating time are reported in this study. Enhancement ratios are obtained for various heat sink configurations. The comparison of thermal performance of different configuration shows that higher enhancement ratio and effective thermal control is obtained with two finned metal foam heat sink.
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ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels
June 10–13, 2018
Dubrovnik, Croatia
Conference Sponsors:
- Fluids Engineering Division
ISBN:
978-0-7918-5119-7
PROCEEDINGS PAPER
Experimental Investigations on Thermal Performance of PCM Based Heat Sink for Passive Cooling of Electronic Components
Rohit Kothari,
Rohit Kothari
Indian Institute of Technology Indore, Indore, India
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Pawan Mahalkar,
Pawan Mahalkar
Indian Institute of Technology Indore, Indore, India
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Santosh K. Sahu,
Santosh K. Sahu
Indian Institute of Technology Indore, Indore, India
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Shailesh I. Kundalwal
Shailesh I. Kundalwal
Indian Institute of Technology Indore, Indore, India
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Rohit Kothari
Indian Institute of Technology Indore, Indore, India
Pawan Mahalkar
Indian Institute of Technology Indore, Indore, India
Santosh K. Sahu
Indian Institute of Technology Indore, Indore, India
Shailesh I. Kundalwal
Indian Institute of Technology Indore, Indore, India
Paper No:
ICNMM2018-7732, V001T11A005; 9 pages
Published Online:
August 23, 2018
Citation
Kothari, R, Mahalkar, P, Sahu, SK, & Kundalwal, SI. "Experimental Investigations on Thermal Performance of PCM Based Heat Sink for Passive Cooling of Electronic Components." Proceedings of the ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2018 16th International Conference on Nanochannels, Microchannels, and Minichannels. Dubrovnik, Croatia. June 10–13, 2018. V001T11A005. ASME. https://doi.org/10.1115/ICNMM2018-7732
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