Microstructures on boiling surfaces had been adopted to study heat transfer enhancement mechanism because of its controllability of precise geometries by MEMS techniques. In addition, several bubble-inducing surfaces such as porous or hydrophobic surfaces were verified to be combined with microstructures for further enhancement of cooling efficiency. In this research, microstructures with porous and dual-wettability (Janus) were fabricated by soft-lithography with replicating molds. In saturated pool boiling at atmospheric pressure, the porous and Janus microstructures increased the heat transfer coefficient by 50% over that of plain-cylindrical microstructures. The increase occurred because the porous and wettability-controlled structures favored vigorous bubble generation, and supported high contact line density, which is strongly related to effective cooling through the near-bubble region.
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ASME 2017 15th International Conference on Nanochannels, Microchannels, and Minichannels
August 27–30, 2017
Cambridge, Massachusetts, USA
Conference Sponsors:
- Fluids Engineering Division
ISBN:
978-0-7918-5830-1
PROCEEDINGS PAPER
Porous and Wettability-Controlled Microstructures for Enhanced Heat Transfer Coefficient in Pool Boiling
Moo Hwan Kim
Moo Hwan Kim
POSTECH, Pohang, Korea
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Hyunwoo Noh
POSTECH, Pohang, Korea
Junseon Yoo
POSTECH, Pohang, Korea
Jin-Oh Kim
POSTECH, Pohang, Korea
Dong-Hwi Kim
POSTECH, Pohang, Korea
Dong-Pyo Kim
POSTECH, Pohang, Korea
Hyun Sun Park
POSTECH, Pohang, Korea
Moo Hwan Kim
POSTECH, Pohang, Korea
Paper No:
ICNMM2017-5535, V001T04A003; 6 pages
Published Online:
November 10, 2017
Citation
Noh, H, Yoo, J, Kim, J, Kim, D, Kim, D, Park, HS, & Kim, MH. "Porous and Wettability-Controlled Microstructures for Enhanced Heat Transfer Coefficient in Pool Boiling." Proceedings of the ASME 2017 15th International Conference on Nanochannels, Microchannels, and Minichannels. ASME 2017 15th International Conference on Nanochannels, Microchannels, and Minichannels. Cambridge, Massachusetts, USA. August 27–30, 2017. V001T04A003. ASME. https://doi.org/10.1115/ICNMM2017-5535
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