There is a dearth of understanding about the underlying mechanisms of heat transfer during various flow boiling regimes prevalent during flow boiling in microchannels. In this paper, high frequency temperature data and flow visualization have been captured simultaneously to understand the heat transfer mechanisms. Experiments were performed on a single microchannel with height, width and length of 0.42 mm, 2.54 mm and 25.4 mm respectively. The working fluid was deionized, de-gassed water. The tested heat flux and mass flux were 28 W/cm2 and 180.1 kg/m2s respectively. The flow boiling regime observed was slug flow. Temperature captured was below the wetted surface and hence Inverse Heat Conduction Problem (IHCP) solution methodology had to be used. Its efficacy was first tested and was found to be reasonably good. Transient wetted surface heat flux, temperature and heat transfer coefficient were calculated using this methodology and were then correlated with the visual data. Depending on the flow boiling phenomena, there were significant variations in heat transfer with time. Several insights into the heat transfer mechanisms have been presented.
Skip Nav Destination
ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
- Fluids Engineering Division
ISBN:
978-0-7918-5687-1
PROCEEDINGS PAPER
Transient Evolution of Heat Transfer Performance During Flow Boiling in a Microchannel
Mrinal Jagirdar,
Mrinal Jagirdar
National University of Singapore, Singapore, Singapore
Search for other works by this author on:
Poh Seng Lee
Poh Seng Lee
National University of Singapore, Singapore, Singapore
Search for other works by this author on:
Mrinal Jagirdar
National University of Singapore, Singapore, Singapore
Poh Seng Lee
National University of Singapore, Singapore, Singapore
Paper No:
ICNMM2015-48300, V001T07A007; 8 pages
Published Online:
November 18, 2015
Citation
Jagirdar, M, & Lee, PS. "Transient Evolution of Heat Transfer Performance During Flow Boiling in a Microchannel." Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. San Francisco, California, USA. July 6–9, 2015. V001T07A007. ASME. https://doi.org/10.1115/ICNMM2015-48300
Download citation file:
22
Views
Related Proceedings Papers
Related Articles
Two-Phase Heat Transfer and Bubble Characteristics in a Microchannel Array
J. Heat Transfer (July,2012)
Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
J. Electron. Packag (March,2017)
Heat Transfer Characteristics and Flow Pattern Visualization for Flow Boiling in a Vertical Narrow Microchannel
J. Electron. Packag (September,2019)
Related Chapters
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment
Energy Balance for a Swimming Pool
Electromagnetic Waves and Heat Transfer: Sensitivites to Governing Variables in Everyday Life
Application of Universal Functions
Applications of Mathematical Heat Transfer and Fluid Flow Models in Engineering and Medicine