The present study proposed a V-shape cannelure structure applicable for electronic cooling thermal module. Initially, simulations are made to find out the best configurations, followed by an actual implementation and verification. From the experimental verification, it is found that the proposed modified thermal module can appreciably reduce the heat sink volume (up to 30%) and still maintain a lower base temperature than the original plain fin design. Yet it is found that an overall 16% improvement of the heat transfer performance can be achieved.

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