The present study proposed a V-shape cannelure structure applicable for electronic cooling thermal module. Initially, simulations are made to find out the best configurations, followed by an actual implementation and verification. From the experimental verification, it is found that the proposed modified thermal module can appreciably reduce the heat sink volume (up to 30%) and still maintain a lower base temperature than the original plain fin design. Yet it is found that an overall 16% improvement of the heat transfer performance can be achieved.
- Heat Transfer Division
- Fluids Engineering Division
A Study on Heat Sink Performance Using V-Shaped Cannelure Structure Fin
Huang, P, & Wang, C. "A Study on Heat Sink Performance Using V-Shaped Cannelure Structure Fin." Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. San Francisco, California, USA. July 6–9, 2015. V001T06A001. ASME. https://doi.org/10.1115/ICNMM2015-48043
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