Surface wettability of materials is important in heat transfer and thermal processes at micro-scale. This paper presents the manipulation of metal surface wettability by nanofluid boiling nanoparticle deposition. As confirmed by microscopy, particles can be deposited on metal surfaces by boiling in nanoparticle suspension, which significantly enhanced the surface wettabiliy relative to that of its original condition. The change in wettability is coupled to boiling conditions, such as nanoparticle concentration, heat flux, boiling duration, substrate roughness and so on. It has been observed that the higher the concentration of nanoparticles in the liquid during the boiling deposition process, the more pronounced the impact on wetting. Hence, surface wettability can be manipulated by controlling the nanoparticle concentration during the nanofluid boiling nanoparticle deposition (NBND) process. Such method can potentially be applied to enhance the heat transfer performance in thermal devices.
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ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
- Fluids Engineering Division
ISBN:
978-0-7918-5687-1
PROCEEDINGS PAPER
Metal Surface Wettability Manipulation by Nanoparticle Deposition During Nanofluid Boiling
Feini Zhang,
Feini Zhang
University of Illinois at Urbana Champaign, Urbana, IL
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Anthony M. Jacobi
Anthony M. Jacobi
University of Illinois at Urbana Champaign, Urbana, IL
Search for other works by this author on:
Feini Zhang
University of Illinois at Urbana Champaign, Urbana, IL
Anthony M. Jacobi
University of Illinois at Urbana Champaign, Urbana, IL
Paper No:
ICNMM2015-48687, V001T04A025; 6 pages
Published Online:
November 18, 2015
Citation
Zhang, F, & Jacobi, AM. "Metal Surface Wettability Manipulation by Nanoparticle Deposition During Nanofluid Boiling." Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. San Francisco, California, USA. July 6–9, 2015. V001T04A025. ASME. https://doi.org/10.1115/ICNMM2015-48687
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