In past efforts, the conditions were determined for the hermetic sealing of a microchannel hemodialyser produced by pressing a hot-embossed polycarbonate microchannel lamina containing sealing bosses, against a 25 μm thick elastoviscoplastic hemodialysis membrane. In this paper, a procedure is developed for quantifying the compressive mechanical behavior of the membrane during loading. An energy balance, of the work of clamping to the strain energy within the membrane, is used to derive a model for predicting the force required to seal the membrane. The force model is used to predict the force required to press a boss a certain distance into the membrane, providing validation of the procedure for measuring the compressive properties of ultra-thin elastoviscoplastic membranes.
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ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems
July 6–9, 2015
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division
- Fluids Engineering Division
ISBN:
978-0-7918-5687-1
PROCEEDINGS PAPER
Determining the Compressive Behavior of an Ultra-Thin Elastoviscoplastic Membrane Used in Sealing a Microchannel Hemodialyser
Patrick S. McNeff,
Patrick S. McNeff
Oregon State University, Corvallis, OR
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Brian K. Paul
Brian K. Paul
Oregon State University, Corvallis, OR
Search for other works by this author on:
Patrick S. McNeff
Oregon State University, Corvallis, OR
Brian K. Paul
Oregon State University, Corvallis, OR
Paper No:
ICNMM2015-48366, V001T01A001; 7 pages
Published Online:
November 18, 2015
Citation
McNeff, PS, & Paul, BK. "Determining the Compressive Behavior of an Ultra-Thin Elastoviscoplastic Membrane Used in Sealing a Microchannel Hemodialyser." Proceedings of the ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels collocated with the ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. ASME 2015 13th International Conference on Nanochannels, Microchannels, and Minichannels. San Francisco, California, USA. July 6–9, 2015. V001T01A001. ASME. https://doi.org/10.1115/ICNMM2015-48366
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